UPB1505GR-E1 データシートの表示（PDF） - NEC => Renesas Technology
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UPB1505GR-E1 Datasheet PDF : 8 Pages
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µPB1505GR
NOTE ON CORRECT USE
(1) Observe precautions for handling because of electro-static sensitive devices.
(2) Form a ground pattern as wide as possible to minimize ground impedance (to prevent undesired operation).
(3) Keep the track length of the ground pins as short as possible.
(4) Connect a bypass capacitor (e.g. 1 000 pF) to the VCC pin.
RECOMMENDED SOLDERING CONDITIONS
This product should be soldered in the following recommended conditions. Other soldering methods and conditions than
the recommended conditions are to be consulted with our sales representatives.
µPB1505GR
Soldering method
Soldering conditions
Recommended conditoin
symbol
Infrared ray reflow
Package peak temperature : 235 °C, Hour : within 30 s. (more than 210 °C),
Time : 3 time, Limited days : no. *
IR35-00-3
VPS
Package peak temperature : 215 °C, Hour : within 40 s. (more than 200 °C),
Time : 3 time, Limited days : no. *
VP-15-00-3
Wave soldering
Soldering tub temperature : less than 260 °C, Hour : within 10 s.
Time : 1 time, Limited days : no. *
WS60-00-1
Pin part heating
Pin area temperature : less than 300 °C, Hour : within 3 s./pin
Limited days : no. *
* : It is the storage days after opening a dry pack, the storage conditions are 25 °C, less than 65 % RH.
Note 1. The combined use of soldering method is to be avoided (However, except the pin area heating method).
For details of recommended soldering conditions for surface mounting, refer to information document SEMICONDUCTOR
DEVICE MOUNTING TECHNOLOGY MANUAL (C10535E).
Data Sheet P10872EJ3V0DS00
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