TEF6621T データシートの表示（PDF） - NXP Semiconductors.

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TEF6621T

Tuner on main-board IC

NXP Semiconductors. 

NXP Semiconductors

9. Limiting values

Table 57. Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134).

Symbol Parameter

Conditions

VCC

∆VCCn

supply voltage

on pins VCC1 and VCC2

voltage difference between any between pins VCC1 and VCC2

supply pins

TEF6621 Min

−0.3

−0.3

DRAFT

DTR++MuAD10aFnR0.Tx3eADFrTRoADnFRTDAmDRFTRAaAFVVUDinTFRnT-ADibtDFRoTRDAaARFDTFrARdTFADTDFRITCRDAARDFTFDARTRFADTAFDRTFRDATADRF

VSCL

voltage on pin SCL

−0.3

+6

V

VSDA

voltage on pin SDA

−0.3

+6

V

VAMRFDEC

VAMRFIN

D VAMRFAGC

VAMIFAGC2

IE VRSSI

VVCODEC

IF VPLL

VPLLREF

S VTEST

VAMIFAGC1

S VVREF

Vn

A Tstg

L Tamb

Tj

C Vesd

voltage on pin AMRFDEC

voltage on pin AMRFIN

voltage on pin AMRFAGC

voltage on pin AMIFAGC2

RSSI voltage

voltage on pin VCODEC

voltage on pin PLL

voltage on pin PLLREF

voltage on pin TEST

voltage on pin AMIFAGC1

voltage on pin VREF

voltage on any other pin

storage temperature

ambient temperature

junction temperature

electrostatic discharge voltage human body model

machine model

N [1] Class 2 according to JESD22-A114.

U [2] Class B according to EIA/JESD22-A115.

−0.3

−0.3

−0.3

−0.3

−0.3

−0.3

−0.3

−0.3

−0.3

−0.3

−0.3

−0.3

−40

−20

-

[1] −2000

[2] −200

+6

+6

+6

+6

+6

+6

+6

+6

+6

+6

+6

+VCC

+150

+85

150

+2 000

+200

V

V

V

V

V

V

V

V

V

V

V

V

°C

°C

°C

V

V

10. Thermal characteristics

Table 58. Thermal characteristics

Symbol Parameter

Conditions

Typ

Unit

Rth(j-a)

thermal resistance from

in free air; single layer board with a [1] 48

K/W

junction to ambient

copper thickness of 35 µm;

see Figure 28

Ψj-top

thermal characterization

parameter from junction to top

of package

4.5

K/W

[1] The thermal resistance depends strongly on the PCB design. An application different to Figure 28 must ensure that the thermal

resistance is below 54 K/W to avoid violation of the maximum junction temperature; see Table 57.

TEF6621_1

Objective data sheet

Rev. 01.04 — 7 August 2008

© NXP B.V. 2008. All rights reserved.

39 of 58

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