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SMAJ54 データシートの表示(PDF) - Cystech Electonics Corp.

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SMAJ54
CYSTEKEC
Cystech Electonics Corp. CYSTEKEC
SMAJ54 Datasheet PDF : 9 Pages
1 2 3 4 5 6 7 8 9
CYStech Electronics Corp.
Spec. No. : C290SA
Issued Date : 2010.01.19
Revised Date : 2013.05.07
Page No. : 1/9
Surface Mount Transient Voltage Suppressors
Peak Pulse Power 400W Stand Off Voltage 5.0 to 440V
SMAJ5.0 thru SMAJ440CA
Features
Low profile package with built-in strain relief for surface mounted
applications
Plastic package has UL flammability classification 94V-0
Ideal for ESD protection of data line in accordance with IEC1000-4-2
(IEC801-2)
Ideal for EFT protection of data line in accordance with IEC1000-4-4
(IEC801-4)
Very-fast response time
Optimized for LAN protection applications
Low incremental surge resistance, excellent clamping capability
Glass passivated junction
High temperature soldering guaranteed: 250°C/10seconds at terminals
400W peak pulse power capability with a 10/1000μs waveform,
repetition rate (duty cycle) : 0.01% (300W above 78V)
Outline
DO-214AC (SMA)
Mechanical Data
Case : JEDEC DO-214AC(SMA) molded plastic body
Terminals: Pure tin plated, solderable per MIL-STD-750 method 2026
Polarity: For uni-directional types, the band denotes the cathode, which is positive with respective to the anode
under normal TVS operation
Mounting position : Any
Weight: 0.002 oz., 0.064 gram
Devices for bidirectional applications
For bi-directional devices, electrical characteristics apply in both directions.
Maximum Ratings and Characteristics(TA=25°C, unless otherwise noted)
Parameter
Symbol
Value
Peak pulse power dissipation with a 10/1000μs waveform (Fig. 1)
PPPM Minimum 400 (Note 1, 2)
Peak pulse current with a 10/1000μs waveform (Fig. 3)
Peak forward surge current, 8.3ms single half sine wave
uni-directional only (Note 2)
Typical thermal resistance, junction-to-case
IPPM
IFSM
RθJC
See next table (Note 1)
40
32
Typical thermal resistance, junction-to-ambient (Note 3)
Maximum instantaneous forward voltage at 25A for
unidirectional only (Note 4)
Operating junction and storage temperature range
RθJA
VF
TJ;TSTG
120
3.5 / 5.0
-55 ~ +150
Notes: 1.Non-repetitive current pulse, per Fig. 3 and derated above TA=25°C per Fig. 2.
2.Mounted on 0.2”×0.2” (5mm×5mm) copper pads to each terminal.
3.Mounted on minimum recommended pad layout.
4.VF<3.5V for devices of VBR<200V and VF<5V for devices of VBR>201V.
Rating is 300W above78V.
Unit
W
A
A
°C/W
°C/W
V
°C
SMAJ5.0 thru SMAJ440CA
CYStek Product Specification

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