H431CN データシートの表示（PDF） - Hi-Sincerity Microelectronics
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H431CN Datasheet PDF : 7 Pages
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HI-SINCERITY
MICROELECTRONICS CORP.
SOT-23 Dimension
Spec. No. : IC200401
Issued Date : 2004.03.01
Revised Date : 2008.04.01
Page No. : 5/7
A
L
3
BS
1
2
V
G
C
D
H
K
J
3-Lead SOT-23 Plastic
Surface Mounted Package
HSMC Package Code: N
SOT-89 Dimension
Marking:
431
Pb Free Mark
Pb-Free: " " (Note)
Normal: None
Note: Pb-free product can distinguish by the green
label or the extra description on the right
side of the label.
Pin Style: 1.Reference 2.Cathode 3.Anode
Material:
• Lead solder plating: Sn60/Pb40 (Normal),
Sn/3.0Ag/0.5Cu or Pure-Tin (Pb-free)
• Mold Compound: Epoxy resin family,
flammability solid burning class: UL94V-0
DIM Min. Max.
A
2.80 3.04
B
1.20 1.60
C
0.89 1.30
D
0.30 0.50
G
1.70 2.30
H 0.013 0.10
J
0.085 0.177
K
0.32 0.67
L
0.85 1.15
S
2.10 2.75
V
0.25 0.65
*: Typical, Unit: mm
C
B
1
2
E
F
G
A
D
3
J
H
I
Marking:
Date Code
HSMC Logo H 4 3 1
Control Code
Pb Free Mark
Pb-Free: " . " (Note)
Normal: None
Note: Green label is used for pb-free packing
Pin Style: 1.Reference 2.Anode 3.Cathode
Material:
• Lead solder plating: Sn60/Pb40 (Normal),
Sn/3.0Ag/0.5Cu or Pure-Tin (Pb-free)
• Mold Compound: Epoxy resin family,
flammability solid burning class: UL94V-0
DIM Min. Max.
A
4.40 4.60
B
4.05 4.25
C
1.50 1.70
D
2.40 2.60
E
0.36 0.51
F
*1.50
-
G *3.00
-
H
1.40 1.60
I
0.35 0.41
*: Typical, Unit: mm
3-Lead SOT-89 Plastic
Surface Mounted Package
HSMC Package Code: M
H431 Series
HSMC Product Specification
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