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ATA6613C データシートの表示(PDF) - Atmel Corporation

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ATA6613C Datasheet PDF : 312 Pages
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2. Absolute Maximum Ratings
Table 2-1. Maximum Ratings of the SiP
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a
stress rating only and functional operation of the device at these or any other conditions beyond those indicated in the
operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended
periods may affect device reliability.
Parameters
Symbol
Min.
Typ.
Max.
Unit
HBM ESD
ANSI/ESD -STM5.1
JESD22 -A114
AEC-Q100 (002)
±2
KV
CDM ESD STM 5.3.1
Corner pins (1, 12, 13, 24, 25, 36, 37, 48)
750
V
All other pins
500
V
Machine model ESD AEC-Q100-Rev.F (003)
±100
V
ESD according to IBEE LIN EMC
Test Spec. 1.0 following IEC 61000-4-2
- Pin VS, LIN, KL_15 (47kΩ/100nF) to GND
±6
KV
- Pin WAKE (33 kΩ serial resistor) to GND
±5
KV
ESD HBM following STM5.1 with 1.5kΩ 100pF
- Pin VS, LIN, KL_15, WAKE to GND
±6
KV
Storage temperature
Operating temperature(1)
Thermal resistance junction to heat slug
Thermal resistance junctiion to ambient
Thermal shutdown of VCC regulator
Ts
–55
Tcase
–40
Rthjc
Rthja
150
+150
°C
+125
°C
5
K/W
25
K/W
165
170
°C
Thermal shutdown of LIN output
150
165
170
°C
Thermal shutdown hysteresis
10
°C
Note: 1. Tcase means the temperature of the heat slug (backside). It is mandatory that this backside temperature is
125°C in the application.
ATA6612C/ATA6613C [DATASHEET]
5
9111L–AUTO–11/14

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