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SF27G データシートの表示(PDF) - Cystech Electonics Corp.

部品番号
コンポーネント説明
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SF27G
CYSTEKEC
Cystech Electonics Corp. CYSTEKEC
SF27G Datasheet PDF : 3 Pages
1 2 3
CYStech Electronics Corp.
DO-204AC(DO-15) Dimension
Spec. No. : C185LG
Issued Date : 2013.03.25
Revised Date : 2013.05.03
Page No. : 3/3
DO-204AC(DO-15) Molded Plastic Package
CYStek Package Code: LG
DIM
Inches
Min. Max.
Millimeters
Min. Max.
A ϕ0.028 ϕ0.034 ϕ0.71 ϕ0.86
B 1.000
-
25.40
-
C 0.230 0.300 5.80 7.60
DIM
Inches
Min. Max.
Millimeters
Min. Max.
D 1.000
-
25.40
-
E ϕ0.104 ϕ0.140 ϕ2.60 ϕ3.60
Notes : 1.Controlling dimension : millimeters.
2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.
Material :
Lead : Axial leads, solderable per MIL-STD-750, Method 2026 guaranteed.
Mold Compound : Epoxy resin family, flammability solid burning class: UL94V-0
Important Notice:
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.
CYStek reserves the right to make changes to its products without notice.
CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
SF21G thru SF28G
CYStek Product Specification

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