NJM7800S
■ THERMAL CHARACTERISTICS
PARAMETER
SYMBOL
VALUE
UNIT
Junction-to-Ambient
Thermal Resistance
θja
105(*1)
40(*2)
C/W
Junction-to-Top of Package
Characterization Parameter
Ψjt
17(*1)
12(*2)
C/W
(*1) Mounted on glass epoxy board. (76.2114.31.6mm:EIA/JDEC standard size, 2Layers, copper area 100mm2)
(*2) Mounted on glass epoxy board. (76.2114.31.6mm:EIA/JDEC standard size, 4Layers)
(4Layers inner foil: 74.274.2mm applying a thermal via hole to a board based on JEDEC standard JESD51-5)
■ POWER DISSIPATION vs. AMBIENT TEMPERATURE
3500
3000
NJM7800SDL1 (TO-252-3)
Power Dissipation
(Topr=-40ºC to +125ºC, Tj=150ºC)
on 4 Layers Board
2500
2000
1500
1000
on 2 Layers Board
500
0
-50 -25
0
25
50
75 100 125 150
Temperature : Ta [ºC]
(*1) Mounted on glass epoxy board. (76.2114.31.6mm:EIA/JDEC standard size, 2Layers, copper area 100mm2)
(*2) Mounted on glass epoxy board. (76.2114.31.6mm:EIA/JDEC standard size, 4Layers)
(4Layers inner foil: 74.2 74.2mm applying a thermal via hole to a board based on JEDEC standard JESD51-5)
Ver.2016-01-08
-5-