UPC1652G データシートの表示（PDF） - NEC => Renesas Technology

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UPC1652G

SILICON MONOLITHIC BIPOLAR INTEGRATED CIRCUIT WIDE BAND AMPLIFIER

NEC => Renesas Technology 

µPC1652G

NOTE ON CORRECT USE

(1) Observe precautions for handling because of electro-static sensitive devices.

(2) Form a ground pattern as wide as possible to keep minimum ground impedance (to prevent undesired oscillation).

(3) Keep the track length of the ground pins as short as possible.

(4) The bypass capacitor should be attached to the VCC pin.

(5) The DC cut capacitor must be each attached to the input and output pins.

RECOMMENDED SOLDERING CONDITIONS

This product should be soldered in the following recommended conditions. Other soldering methods and

conditions than the recommended conditions are to be consulted with our sales representatives.

µPC1652G

Soldering Method

Infrared ray reflow

VPS

Wave soldering

Pin part heating

Soldering Conditions

Package peak temperature: 235 °C, Hour: within 30 s.

(more than 210 °C), Time: 3 times, Limited days: no.Note

Package peak temperature: 215 °C, Hour: within 40 s.

(more than 200 °C), Time: 3 times, Limited days: no.Note

Soldering tub temperature: less than 260 °C, Hour: within 10 s.

Time: 1 time, Limited days: no.Note

Pin area temperature: less than 300 °C, Hour: within 3 s/pin.

Limited days: no.Note

Recommended

Condition Symbol

IR35-00-3

VP15-00-3

WS60-00-1

Note It is the storage days after opening a dry pack, the storage conditions are 25 °C, less than 65 % RH.

Caution The combined use of soldering method is to be avoided (However, except the pin area heating

method).

For details of recommended soldering conditions for surface mounting, refer to information document SEMICON-

DUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL (C10535E).

4

Data Sheet P12443EJ5V0DS00

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