119915-HMC688LP4 データシートの表示（PDF） - Analog Devices

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119915-HMC688LP4

BiCMOS MMIC MIXER W/ INTEGRATED LO AMPLIFIER, 2.0 - 2.7 GHz

Analog Devices 

Outline Drawing

10

HMC688LP4 / 688LP4E

v01.1010

BiCMOS MMIC MIXER W/ INTEGRATED

LO AMPLIFIER, 2.0 - 2.7 GHz

NOTES:

1. PACKAGE BODY MATERIAL: LOW STRESS INJECTION MOLDED

PLASTIC SILICA AND SILICON IMPREGNATED.

2. LEAD AND GROUND PADDLE MATERIAL: COPPER ALLOY.

3. LEAD AND GROUND PADDLE PLATING: 100% MATTE TIN.

4. DIMENSIONS ARE IN INCHES [MILLIMETERS].

5. LEAD SPACING TOLERANCE IS NON-CUMULATIVE.

6. PAD BURR LENGTH SHALL BE 0.15mm MAX.

PAD BURR HEIGHT SHALL BE 0.25mm MAX.

7. PACKAGE WARP SHALL NOT EXCEED 0.05mm

8. ALL GROUND LEADS AND GROUND PADDLE

MUST BE SOLDERED TO PCB RF GROUND.

9. REFER TO HITTITE APPLICATION NOTE

FOR SUGGESTED PCB LAND PATTERN.

Package Information

Part Number

Package Body Material

HMC688LP4

Low Stress Injection Molded Plastic

Lead Finish

Sn/Pb Solder

HMC688LP4E RoHS-compliant Low Stress Injection Molded Plastic

[1] Max peak reflow temperature of 235 °C

[2] Max peak reflow temperature of 260 °C

[3] 4-Digit lot number XXXX

100% matte Sn

MSL Rating

MSL1 [1]

MSL1 [2]

Package Marking [3]

H688

XXXX

H688

XXXX

10 - 5

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Trademarks and registered trademarks aArepthpelpircopaetrityoonf thSeiur rpesppeoctrivte: oPwhneorsn. e: 978-250-33A4p3plicoartioanpSpusp@pohrti:tPtihteo.nceo: 1m-800-ANALOG-D

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