MSMCJ54 データシートの表示（PDF） - Microsemi Corporation
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MSMCJ54 Datasheet PDF : 7 Pages
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MSMCG5.0A – MXLSMCG170CAe3,
MSMCJ5.0 – MXLSMCJ170CAe3
MAXIMUM RATINGS
Parameters/Test Conditions
Junction and Storage Temperature
Thermal Resistance Junction-to-Lead
Thermal Resistance Junction-to-Ambient (1)
Peak Pulse Power Dissipation @ 25 ºC (at 10/1000 µs,
see Figures 1, 2, and 3)
Impulse Repetition Rate (duty factor)
tclamping (0 volts to V (BR) min.)
Unidirectional
Bidirectional
Rated Average Power Dissipation
Maximum Forward Surge Current (2)
TL = +30 ºC
TA = +25 ºC
Solder Temperature @ 10 s
Symbol
TJ and TSTG
R ӨJL
R ӨJA
P PP
df
t clamping
P M(AV)
IFSM
TSP
Value
-65 to +150
20
80
1500
0.01
<100
<5
6
1.56(1)
200
260
Notes: 1. When mounted on FR4 PC board (1oz Cu) with recommended footprint (see last page).
2. Peak impulse of 8.3 ms half-sine wave at 25 ºC (unidirectional only).
Unit
ºC
ºC/W
ºC/W
W
%
ps
ns
W
A (pk)
oC
MECHANICAL and PACKAGING
• CASE: Void-free transfer molded thermosetting epoxy body meeting UL94V-0.
• TERMINALS: Tin-lead or RoHS compliant annealed matte-tin plating. Solderable to MIL-STD-750, method 2026.
• MARKING: Part number marked on package.
• POLARITY: Cathode indicated by band. No cathode band on bi-directional devices.
• TAPE & REEL option: Standard per EIA-481-2 with 16 mm tape (add “TR” suffix to part number). Consult factory for quantities.
• WEIGHT: Approximately 0.25 grams.
• See Package Dimensions on last page.
Reliability Level*
M
MA
MX
MXL
*(see High Reliability
Up-Screened Plastic
Products Portfolio)
Surface Mount
Package
1500 W Power Level
Gull-wing Lead Frame
G = Gull-Wing
J = J-Bend
PART NOMENCLATURE
MX SM C G 5.0 C A e3
RF01001, Rev. A (1/4/13)
©2013 Microsemi Corporation
RoHS Compliance
e3 = RoHS Compliant
Blank = non-RoHS Compliant
+/- 5% Tolerance Level
Uni/Bidirectional
C = Bidirectional
Blank = Unidirectional
Reverse Stand-Off Voltage
(see Electrical Characteristics
table)
Page 2 of 7
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