SM05-02HTG データシートの表示（PDF） - Littelfuse, Inc

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SM05-02HTG

TVS Diode Arrays (SPA®Diodes)

Littelfuse, Inc 

TVS Diode Arrays (SPA® Diodes)

General Purpose ESD Protection - SM05 through SM36

SM24 Transmission Line Pulsing(TLP) Plot

20

18

16

14

12

10

8

6

4

2

0

0

SM24

5

10

15

20

25

30

35

40

TLP Voltage (V)

SM36 Transmission Line Pulsing(TLP) Plot

SM36

20

18

16

14

12

10

8

6

4

2

0

0 5 10 15 20 25 30 35 40 45 50 55

TLP Voltage (V)

Soldering Parameters

Reflow Condition

Pb – Free assembly

- Temperature Min (Ts(min))

Pre Heat - Temperature Max (Ts(max))

- Time (min to max) (ts)

Average ramp up rate (Liquidus) Temp

(TL) to peak

TS(max) to TL - Ramp-up Rate

Reflow

- Temperature (TL) (Liquidus)

- Temperature (tL)

Peak Temperature (TP)

Time within 5°C of actual peak

Temperature (tp)

Ramp-down Rate

Time 25°C to peak Temperature (TP)

Do not exceed

150°C

200°C

60 – 180 secs

3°C/second max

3°C/second max

217°C

60 – 150 seconds

260+0/-5 °C

20 – 40 seconds

6°C/second max

8 minutes Max.

260°C

Ordering Information

Part Number

SM05-02HTG

SM12-02HTG

SM15-02HTG

SM24-02HTG

SM36-02HTG

Package

SOT23-3

SOT23-3

SOT23-3

SOT23-3

SOT23-3

Marking Min. Order Qty.

M05

3000

M12

3000

M15

3000

M24

3000

M36

3000

TP

TL

TS(max)

TS(min)

25

Ramp-up

Preheat

tS

time to peak temperature

tP

Critical Zone

TL to TP

tL

Ramp-down

Time

Product Characteristics

Lead Plating

Lead Material

Lead Coplanarity

Substitute Material

Body Material

Flammability

Matte Tin

Copper Alloy

0.0004 inches (0.102mm)

Silicon

Molded Epoxy

UL 94 V-0

Notes :

1. All dimensions are in millimeters

2. Dimensions include solder plating.

3. Dimensions are exclusive of mold flash & metal burr.

4. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form.

5. Package surface matte finish VDI 11-13.

© 2016 Littelfuse, Inc.

9

Specifications are subject to change without notice.

Revised: 01/04/17

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