AUIRFR4105Z データシートの表示（PDF） - Kersemi Electronic Co., Ltd.

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AUIRFR4105Z

AUTOMOTIVE GRADE

Kersemi Electronic Co., Ltd. 

AUTOMOTIVE GRADE

AUIRFR4105Z

AUIRFU4105Z

Features

● Advanced Process Technology

● Ultra Low On-Resistance

● 175°C Operating Temperature

● Fast Switching

G

● Repetitive Avalanche Allowed up to Tjmax

● Lead-Free, RoHS Compliant

● Automotive Qualified *

Description

Specifically designed for Automotive applications,

this HEXFET® Power MOSFET utilizes the latest

processing techniques to achieve extremely low on-

resistance per silicon area. Additional features of this

design are a 175°C junction operating temperature,

fast switching speed and improved repetitive ava-

lanche rating . These features combine to make this

design an extremely efficient and reliable device for

use in Automotive applications and a wide variety of

other applications.

D

V(BR)DSS

55V

RDS(on) max. 24.5mΩ

S

ID

30A

D

S

G

D-Pak

AUIRFR4105Z

S

D

I-Pak G

AUIRFU4105Z

G

Gate

D

Drain

S

Source

Absolute Maximum Ratings

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These

are stress ratings only; and functional operation of the device at these or any other condition beyond those indicated in

the specifications is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device

reliability. The thermal resistance and power dissipation ratings are measured under board mounted and still air conditions.

Ambient temperature (TA) is 25°C, unless otherwise specified.

Parameter

ID @ TC = 25°C Continuous Drain Current, VGS @ 10V

™ ID @ TC = 100°C Continuous Drain Current, VGS @ 10V

IDM

Pulsed Drain Current

PD @TC = 25°C Power Dissipation

VGS

EAS

EAS (tested )

IAR

EAR

TJ

TSTG

Linear Derating Factor

Gate-to-Source Voltage

d Single Pulse Avalanche Energy (Thermally Limited)

h Single Pulse Avalanche Energy Tested Value

Ù Avalanche Current

g Repetitive Avalanche Energy

Operating Junction and

Storage Temperature Range

Soldering Temperature, for 10 seconds (1.6mm from case )

Mounting Torque, 6-32 or M3 screw

Thermal Resistance

Parameter

RθJC

j Junction-to-Case

RθJA

i Junction-to-Ambient (PCB mount)

RθJA

Junction-to-Ambient

Max.

30

21

120

48

0.32

± 20

29

46

See Fig.12a, 12b, 15, 16

-55 to + 175

300

y y 10 lbf in (1.1N m)

Typ.

–––

–––

–––

Max.

3.12

50

110

Units

A

W

W/°C

V

mJ

A

mJ

°C

Units

°C/W

www.kersemi.com

1

07/23/2010

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