P5KF_ データシートの表示（PDF） - Panasonic Corporation
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P5KF_ Datasheet PDF : 7 Pages
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AXK(5/6)F
SPECIFICATIONS
1. Characteristics
Electrical
characteristics
Mechanical
characteristics
Environmental
characteristics
Lifetime
characteristics
Unit weight
Item
Rated current
Rated voltage
Breakdown voltage
Insulation resistance
Contact resistance
Composite insertion force
Composite removal force
Contact holding force
Ambient temperature
Soldering heat resistance
Storage temperature
Thermal shock resistance
(header and socket mated)
Humidity resistance
(header and socket mated)
Saltwater spray resistance
(header and socket mated)
H2S resistance
(header and socket mated)
Insertion and removal life
Specifications
0.5A/contact (Max. 10 A at total contacts)
60V AC/DC
150V AC for 1 minute
Min. 1,000MΩ (initial)
Max. 90mΩ
Max. 0.981N/contacts × contacts (initial)
Min. 0.0588N/contacts × contacts
Min. 0.981N/contact
–55°C to +85°C
Max. peak temperature of 260°C (on the surface
of the PC board around the connector terminals)
300°C within 5 seconds, 350°C within 3 seconds
–55°C to +85°C (product only)
–40°C to +50°C (emboss packing)
5 cycles, insulation resistance min. 100MΩ,
contact resistance max. 90mΩ
120 hours, insulation resistance min. 100MΩ,
contact resistance max. 90mΩ
24 hours, insulation resistance min. 100MΩ,
contact resistance max. 90mΩ
48 hours, contact resistance max. 90mΩ
50 times
Mated height 1.5mm, 20 contacts; Socket: 0.06g
Header: 0.04g
Conditions
Detection current: 1mA
Using 500V DC megger
Based on the contact resistance measurement method specified by
JIS C 5402.
Measuring the maximum force.
As the contact is axially pull out.
No freezing at low temperatures
Infrared reflow soldering
Soldering iron
No freezing at low temperatures. No dew condensation.
Sequence
1.
–55
0
–3
°C,
30
minutes
2. ~ , Max. 5 minutes
3.
85
+3
0
°C,
30
minutes
4. ~ , Max. 5 minutes
Bath temperature 40±2°C, humidity 90 to 95% R.H.
Bath temperature 35±2°C, saltwarter concentration 5±1%
Bath temperature 40±2°C, gas concentration 3±1 ppm,
humidity 75 to 80% R.H.
Repeated insertion and removal speed of max. 200 times/hours
2. Material and surface treatment
Part name
Material
Molded portion
LCP resin (UL94V-0)
Contact/Post
Copper alloy
Surface treatment
—
Contact portion: Ni plating on base, Au plating on surface
Terminal portion: Ni plating on base, Au plating on surface (Except for thick of terminal)
The section close to the soldering portion has a nickel barrier.
(The nickel base is exposed.)
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