BAW56WT1_01 データシートの表示（PDF） - ON Semiconductor

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BAW56WT1_01

Dual Switching Diode

ON Semiconductor 

BAW56WT1

MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS

Surface mount board layout is a critical portion of the total

design. The footprint for the semiconductor packages must

be the correct size to insure proper solder connection

interface between the board and the package. With the

correct pad geometry, the packages will self align when

subjected to a solder reflow process.

0.025

0.65

0.025

0.65

0.035

0.9

0.028

0.7

0.075

1.9

inches

mm

SC-70/SOT-323 POWER DISSIPATION

The power dissipation of the SC-70/SOT-323 is a function the equation for an ambient temperature TA of 25°C, one can

of the collector pad size. This can vary from the minimum calculate the power dissipation of the device which in this

pad size for soldering to the pad size given for maximum case

is

200

power dissipation. Power dissipation for a surface mount milliwatts.

device is determined by TJ(max), the maximum rated

junction temperature of the die, RθJA, the thermal resistance

from the device junction to ambient; and the operating

PD =

150°C – 25°C

0.625°C/W

= 200 milliwatts

The 0.625°C/W assumes the use of the recommended

temperature, TA. Using the values provided on the data

sheet,

PD

can

be

calculated

as

follows.

footprint on a glass epoxy printed circuit board to achieve a

power dissipation of 200 milliwatts. Another alternative

would be to use a ceramic substrate or an aluminum core

PD =

TJ(max) – TA

RθJA

The values for the equation are found in the maximum

board such as Thermal Clad™. Using a board material such

as Thermal Clad, a power dissipation of 300 milliwatts can

be achieved using the same footprint.

ratings table on the data sheet. Substituting these values into

SOLDERING PRECAUTIONS

The melting temperature of solder is higher than the rated

temperature of the device. When the entire device is heated

to a high temperature, failure to complete soldering within

a short time could result in device failure. Therefore, the

following items should always be observed in order to

minimize the thermal stress to which the devices are

subjected.

• Always preheat the device.

• The delta temperature between the preheat and

soldering should be 100°C or less.*

• When preheating and soldering, the temperature of the

leads and the case must not exceed the maximum

temperature ratings as shown on the data sheet. When

using infrared heating with the reflow soldering

method, the difference should be a maximum of 10°C.

• The soldering temperature and time should not exceed

260°C for more than 10 seconds.

• When shifting from preheating to soldering, the

maximum temperature gradient should be 5°C or less.

• After soldering has been completed, the device should

be allowed to cool naturally for at least three minutes.

Gradual cooling should be used as the use of forced

cooling will increase the temperature gradient and

result in latent failure due to mechanical stress.

• Mechanical stress or shock should not be applied

during cooling

* Soldering a device without preheating can cause

excessive thermal shock and stress which can result in

damage to the device.

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