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BAW56WT1G_11 データシートの表示(PDF) - ON Semiconductor

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BAW56WT1G_11
ON-Semiconductor
ON Semiconductor ON-Semiconductor
BAW56WT1G_11 Datasheet PDF : 4 Pages
1 2 3 4
BAW56WT1G,
SBAW56WT1G
Dual Switching Diode,
Common Anode
Features
AECQ101 Qualified and PPAP Capable
S Prefix for Automotive and Other Applications Requiring Unique
Site and Control Change Requirements
These Devices are PbFree, Halogen Free/BFR Free and are RoHS
Compliant*
MAXIMUM RATINGS (TA = 25C)
Rating
Symbol Max Unit
Reverse Voltage
VR
70
V
Forward Current
IF
200
mA
Peak Forward Surge Current
IFM(surge) 500
mA
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
THERMAL CHARACTERISTICS (TA = 25C)
Characteristic
Symbol Max Unit
Total Device Dissipation FR5 Board
(Note 1)
TA = 25C
Derate above 25C
PD
200
mW
1.6 mW/C
Thermal Resistance, JunctiontoAmbient
Total Device Dissipation
Alumina Substrate (Note 2) TA = 25C
Derate above 25C
RqJA
PD
625
C/W
300
mW
2.4 mW/C
Thermal Resistance, JunctiontoAmbient
Junction and Storage Temperature
RqJA
TJ, Tstg
417
55 to
+150
C/W
C
1. FR5 = 1.0  0.75  0.062 in.
2. Alumina = 0.4  0.3  0.024 in. 99.5% alumina.
http://onsemi.com
SC70
CASE 419
STYLE 4
ANODE
3
CATHODE
1
2
CATHODE
MARKING DIAGRAM
A1 M G
G
1
A1 = Device Code
M = Date Code*
G = PbFree Package
(Note: Microdot may be in either location)
*Date Code orientation may vary depending
upon manufacturing location.
ORDERING INFORMATION
Device
Package
Shipping
BAW56WT1G
SBAW56WT1G
SC70 3,000 / Tape & Reel
(PbFree)
SC70 3,000 / Tape & Reel
(PbFree)
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
*For additional information on our PbFree strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
Semiconductor Components Industries, LLC, 2011
1
November, 2011 Rev. 7
Publication Order Number:
BAW56WT1/D

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