SA636BS データシートの表示（PDF） - NXP Semiconductors.

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SA636BS

Low voltage high performance mixer FM IF system with high-speed RSSI

NXP Semiconductors. 

NXP Semiconductors

SA636

Low voltage high performance mixer FM IF system

6.2 Pin description

Table 2. Pin description

Symbol

Pin

SSOP20

RF_IN

1

RF_IN_DECOUPL

2

OSC_OUT

3

OSC_IN

4

VCC

5

RSSI_FEEDBACK

6

RSSI_OUT

7

POWER_DOWN_CTRL 8

DATA_OUT

9

QUADRATURE_IN

10

LIMITER_OUT

11

LIMITER_DECOUPL 12

LIMITER_DECOUPL 13

LIMITER_IN

14

GND

15

IF_AMP_OUT

16

IF_AMP_DECOUPL

17

IF_AMP_IN

18

IF_AMP_DECOUPL

19

MIXER_OUT

20

-

-

Description

HVQFN20

19

RF input

20

RF input decoupling pin

1

oscillator output (emitter)

2

oscillator input (base)

3

positive supply voltage

4

RSSI amplifier negative feedback terminal

5

RSSI output

6

power-down control; active HIGH

7

data output

8

quadrature detector input terminal

9

limiter amplifier output

10

limiter amplifier decoupling pin

11

limiter amplifier decoupling pin

12

limiter amplifier input

13[1]

ground; negative supply

14

IF amplifier output

15

IF amplifier decoupling pin

16

IF amplifier input

17

IF amplifier decoupling pin

18

mixer output

DAP

exposed die attach paddle; connect to ground

[1] For the HVQFN20 package, the exposed die attach paddle must be connected to device ground pin 13 and

the PCB ground plane. GND pin must be connected to supply ground for proper device operation. For

enhanced thermal, electrical, and board level performance, the exposed pad needs to be soldered to the

board using a corresponding thermal pad on the board and for proper heat conduction through the board,

thermal vias need to be incorporated in the printed-circuit board in the thermal pad region.

SA636

Product data sheet

All information provided in this document is subject to legal disclaimers.

Rev. 7 — 16 June 2016

© NXP Semiconductors N.V. 2016. All rights reserved.

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