WS128K32-XG2UX データシートの表示（PDF） - Microsemi Corporation
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WS128K32-XG2UX Datasheet PDF : 10 Pages
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WS128K32-XXX
128Kx32 SRAM MODULE, SMD 5962-93187
FEATURES
Access Times of 70, 85, 100, 120ns
MIL-STD-883 Compliant Devices Available
Packaging
• 66-pin, PGA Type, 1.075 inch square, Hermetic Ceramic
HIP (Package 400).
• 68 lead, 40mm Low Profile CQFP, 3.56mm (0.140")
(Package 502).
• 68 lead, Hermetic CQFP (G2U), 22.4mm (0.880 inch)
square, 4.57mm (0.140 inch) high, (Package 510)
Organized as 128Kx32; User Configurable as 256Kx16 or
512Kx8
Commercial, Industrial and Military Temperature Ranges
5V Power Supply
Low Power CMOS
TTL Compatible Inputs and Outputs
Built in Decoupling Caps and Multiple Ground Pins for Low
Noise Operation
Weight
• WS128K32-XG2UX - 8 grams typical
• WS128K32-XH1X - 13 grams typical
• WS128K32-XG4TX - 20 grams typical
Upgradeable to 512Kx32
This product is subject to change without notice.
FIGURE 1 – PIN CONFIGURATION FOR WS128K32N-XH1X
TOP VIEW
1
12
23
I/O8
WE2# I/O15
I/O9
CS2# I/O14
I/O10 GND
I/O13
A14
I/O11
I/O12
A16
A10
OE#
A11
A9
NC
A0
A15
WE1#
NC
VCC
I/O7
I/O0
CS1# I/O6
I/O1
NC
I/O5
I/O2
I/O3
I/O4
11
22
33
34
45
56
I/O24
VCC
I/O31
I/O25 CS4#
I/O30
I/O26 WE4#
I/O29
A7
I/O27
I/O28
A12
A4
A1
NC
A5
A2
A13
A6
A3
A8 WE3#
I/O23
I/O16 CS3#
I/O22
I/O17 GND
I/O21
I/O18
I/O19
I/O20
44
55
66
I/O0-31
A0-16
WE1-4#
CS1-4#
OE#
VCC
GND
NC
PIN DESCRIPTION
Data Inputs/Outputs
Address Inputs
Write Enables
Chip Selects
Output Enable
Power Supply
Ground
Not Connected
BLOCK DIAGRAM
OE#
A0-16
WE1# CS1#
128K x 8
WE2# CS2#
128K x 8
WE3# CS3#
128K x 8
WE4# CS4#
128K x 8
8
I/O0-7
8
I/O8-15
8
I/O16-23
8
I/O24-31
Microsemi Corporation reserves the right to change products or specifications without notice.
May 2011 © 2011 Microsemi Corporation. All rights reserved.
1
Rev. 5
Microsemi Corporation • (602) 437-1520 • www.whiteedc.com
www.microsemi.com
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