HCPL-2630 データシートの表示（PDF） - Broadcom Corporation
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HCPL-2630 Datasheet PDF : 30 Pages
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6N137, HCNW137, HCNW2601, HCNW2611, HCPL-0600, HCPL-0601, HCPL-
0611, HCPL-0630, HCPL-0631, HCPL-0661, HCPL-2601, HCPL-2611, HCPL-
2630, HCPL-2631, HCPL-4661 Data Sheet
High CMR, High Speed TTL Compatible Optocouplers
8-Pin Widebody DIP Package with Gull Wing Surface Mount Option 300 (HCNW137,
HCNW2601/11)
11.23 ± 0.15
(0.442 ± 0.006)
8
7
6
5
LAND PATTERN RECOMMENDATION
9.00 ± 0.15
(0.354 ± 0.006)
1
2
3
4
1.55
(0.061)
MAX.
4.00
(0.158)
MAX.
13.56
(0.534)
1.3
(0.051)
2.29
(0.09)
12.30 ± 0.30
(0.484 ± 0.012)
11.00 MAX.
(0.433)
1.80 ± 0.15
(0.071 ± 0.006)
2.54
(0.100)
BSC
DIMENSIONS IN MILLIMETERS (INCHES).
0.75 ± 0.25
(0.030 ± 0.010)
LEAD COPLANARITY = 0.10 mm (0.004 INCHES).
NOTE: FLOATING LEAD PROTRUSION IS 0.25 mm (10 mils) MAX.
1.00 ± 0.15
(0.039 ± 0.006)
0.254
+ 0.076
- 0.0051
(0.010
+ 0.003)
- 0.002)
7° NOM.
Test Rating Code, Z
L – Option x2x
V – Option x5x or x6x
Optional Identification Code
A – Avago
– UL Logo
P – Special Program Code
Reflow Soldering Profile
The recommended reflow soldering conditions are per JEDEC Standard J-STD-020 (latest revision). Non-halide flux should
be used.
Regulatory Information
The 6N137, HCPL-26xx/06xx/46xx, and HCNW137/26xx have been approved by the following organizations:
UL
IEC/EN/DIN EN 60747-5-5
CSA
Recognized under UL 1577, Component Recognition Program, File E55361.
Approved under CSA Component Acceptance Notice #5, File CA 88324.
Broadcom
AV02-0940EN
9
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