RBO08-40G データシートの表示（PDF） - STMicroelectronics
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RBO08-40G Datasheet PDF : 14 Pages
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A new technology available today is IMS - an
Insulated Metallic Substrate. This offers greatly
enhanced thermal characteristics for surface
mount components. IMS is a substrate consisting
of three different layers, (I) the base material which
is available as an aluminium or a copper plate, (II)
a thermal conductive dielectrical layer and (III) a
copper foil, which can be etched as a circuit layer.
Using this material a thermal resistance of 8°C/W
with 40 cm2 of board floating in air is achievable
(see fig. 4). If even higher power is to be dissipated
an external heatsink could be applied which leads
to an Rth(j-a) of 3.5°C/W (see Fig. 5), assuming
that Rth (heatsink-air) is equal to Rth
(junction-heatsink). This is commonly applied in
practice, leading to reasonable heatsink
dimensions. Often power devices are defined by
RBO08-40G / RBO08-40M / RBO08-40T
considering the maximum junction temperature of
the device. In practice , however, this is far from
being exploited. A summary of various power
management capabilities is made in table 1 based
on a reasonable delta T of 70°C junction to air.
The PowerSO-10 concept also represents an
attractive alternative to C.O.B. techniques.
PowerSO-10 offers devices fully tested at low
and high temperature. Mounting is simple - only
conventional SMT is required - enabling the users
to get rid of bond wire problems and the problem to
control the high temperature soft soldering as well.
An optimized thermal management is guaranteed
through PowerSO-10 as the power chips must in
any case be mounted on heat spreaders before
being mounted onto the substrate.
Fig. 4 : Mounting on metal backed board
Copper foil
Insulation
Aluminium
Fig. 5 : Mounting on metal backed board with an
external heatsink applied
Copper foil
FR4 board
Aluminium
heatsink
TABLE 1
PowerSo-10 package mounted on
1.FR4 using the recommended pad-layout
2.FR4 with heatsink on board (6cm2)
3.FR4 with copper-filled through holes and external heatsink applied
4. IMS floating in air (40 cm2)
5. IMS with external heatsink applied
Rth (j-a)
50 °C/W
35 °C/W
12 °C/W
8 °C/W
3.5 °C/W
P Diss
1.5 W
2.0 W
5.8 W
8.8 W
20 W
11/14
®
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