HMC156A データシートの表示（PDF） - Micross Components

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HMC156A

GaAs MMIC PASSIVE FREQUENCY DOUBLER, 0.7 - 2.4 GHz INPUT

Micross Components 

Outline Drawing

2

v00.0111

HMC156A

GaAs MMIC PASSIVE FREQUENCY

DOUBLER, 0.7 - 2.4 GHz INPUT

Die Packaging Information [1]

Standard

Alternate

WP-13 (Waffle Pack)

[2]

[1] Refer to the “Packaging Information” section for die

packaging dimensions.

[2] For alternate packaging information contact Hittite

Microwave Corporation.

NOTES:

1. ALL UNLABELED PADS MUST BE BONDED TO GROUND (8 TOTAL).

2. ALL DIMENSIONS IN INCHES [MILLIMETERS]

3. ALL TOLERANCES ARE ±0.001 [0.025]

4. DIE THICKNESS IS ±0.005 [0.127]

5. BOND PADS ARE ±0.004 [0.100] SQUARE

6. EQUALLY SPACED AT ±0.006 [0.150] CENTERS

7. BACKSIDE METALLIZATION: NONE

8. BOND PAD METALLIZATION: GOLD

Pad Description

Pad Number

Function

1

RFIN

Description

DC coupled and matched to 50 Ohm.

Interface Schematic

2

RFOUT

DC coupled and matched to 50 Ohm.

Die Bottom

GND

Die bottom must be connected to RF/DC ground.

2-3

For price, delivery and to place orders: Hittite Microwave Corporation, 20 Alpha Road, Chelmsford, MA 01824

Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com

Application Support: Phone: 978-250-3343 or apps@hittite.com

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