ICX081AK データシートの表示（PDF） - Sony Semiconductor

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ICX081AK

Diagonal 6mm (Type 1/3) CCD Image Sensor for PAL Color Video Cameras

Sony Semiconductor 

ICX081AK

Diagonal 6mm (Type 1/3) CCD Image Sensor for PAL Color Video Cameras

Description

The ICX081AK is an interline CCD solid-state

16 pin DIP (Plastic)

image sensor suitable for PAL color video cameras.

This chip conforms to DV standard SD mode, and

has the optimal number of pixels for MPEG2 Main

level. While achieving a horizontal resolution of 450

TV lines, the area has been expanded 33% in both

vertical and horizontal directions, making the chip

suitable for electronic vibration stabilizer and

electronic panning/tilting. In addition, complete 16:9

wide aspect ratio images are provided with a high

picture quality without requiring vertical interpolation.

High sensitivity and low dark current are achieved

through the adoption of Ye, Cy, Mg and G

Pin 1

complementary color mosaic filters and HAD (Hole-

8

Accumulation Diode) sensors.

This chip features a field period readout system

and an electronic shutter with variable charge-

V

storage time.

The package is a 16-pin DIP (Plastic), and both

top and bottom surface reference can be assured at

12

the same time.

4

H

50

Pin 9

Features

• Supports electronic vibration stabilizer and electronic panning/tilting Optical black position

(33%/one side)

• Supports electronic zoom

(Top View)

• Supports DV standard SD mode and MPEG2 Main level (13.5MHz)

• Supports 16:9 wide aspect ratio (for both 18MHz and 4fsc)

• Supply voltage: 12V

• Horizontal register and reset gate: 2.7 to 3.6V drive

• No voltage adjustment (Reset gate and substrate bias are not adjusted.)

• High resolution, high sensitivity, low dark current and low smear

• Excellent antiblooming characteristics

• Continuous variable-speed shutter (1/50 to 1/10000s)

• Supports short exit pupil distance (Recommended range: –20 to –100mm)

• Ye, Cy, Mg and G complementary color mosaic filters on chip

• 16-pin high precision plastic package (both top and bottom surface reference possible)

Device Structure

• Interline CCD image sensor

• Image size:

• Total number of pixels:

• Total number of effective pixels:

• Number of effective pixels: 4:3 PAL:

16:9 18MHz:

16:9 4fsc:

• Chip size:

• Unit cell size:

• Optical black:

• Number of dummy bits:

• Substrate material:

Diagonal 6mm (Type 1/3)

1016 (H) x 794 (V) approx. 810K pixels

962 (H) x 774 (V) approx. 740K pixels

702 (H) x 575 (V) approx. 400K pixels

936 (H) x 575 (V) approx. 540K pixels

922 (H) x 575 (V) approx. 530K pixels

5.90mm (H) x 4.92mm (V)

5.15µm (H) x 4.70µm (V)

Horizontal (H) direction: Front 4 pixels, rear 50 pixels

Vertical (V) direction: Front 12 pixels, rear 8 pixels

Horizontal 28

Vertical 1 (even fields only)

Silicon

Sony reserves the right to change products and specifications without prior notice. This information does not convey any license by

any implication or otherwise under any patents or other right. Application circuits shown, if any, are typical examples illustrating the

operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits.

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E95703D99

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