5164ISZ データシートの表示（PDF） - Renesas Electronics
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5164ISZ Datasheet PDF : 17 Pages
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EL5164, EL5165, EL5364
Pin Configurations
EL5165
(5 LD SOT-23)
TOP VIEW
OUT 1
VS- 2
+-
IN+ 3
5 VS+
4 IN-
EL5364
(16 LD SOIC, QSOP)
TOP VIEW
INA+ 1
CEA 2
VS- 3
CEB 4
INB+ 5
16 INA-
-
+
15 OUTA
14 VS+
+
-
13 OUTB
12 INB-
NC 6
CEC 7
INC+ 8
11 NC
+
-
10 OUTC
9 INC-
Ordering Information
PART NUMBER
(Notes 2, 3)
PART
MARKING
PACKAGE
(Pb-free)
PKG.
DWG. #
EL5164ISZ
5164ISZ
8 Ld SOIC (150 mil)
M8.15E
EL5164ISZ-T7 (Note 1)
5164ISZ
8 Ld SOIC (150 mil)
M8.15E
EL5164ISZ-T13 (Note 1)
5164ISZ
8 Ld SOIC (150 mil)
M8.15E
EL5164IWZ-T7 (Note 1)
BAMA (Note 4)
6 Ld SOT-23
P6.064A
EL5164IWZ-T7A (Note 1)
BAMA (Note 4)
6 Ld SOT-23
P6.064A
EL5165IWZ-T7 (Note 1)
BANA (Note 4)
5 Ld SOT-23
P5.064A
EL5165IWZ-T7A (Note 1)
BANA (Note 4)
5 Ld SOT-23
P5.064A
EL5364ISZ
EL5364ISZ
16 Ld SOIC (150 mil)
MDP0027
EL5364ISZ-T7 (Note 1)
EL5364ISZ
16 Ld SOIC (150 mil)
MDP0027
EL5364ISZ-T13 (Note 1)
EL5364ISZ
16 Ld SOIC (150 mil)
MDP0027
EL5364IUZ
5364IUZ
16 Ld QSOP (150 mil)
MDP0040
EL5364IUZ-T7 (Note 1)
5364IUZ
16 Ld QSOP (150 mil)
MDP0040
EL5364IUZ-T13 (Note 1)
5364IUZ
16 Ld QSOP (150 mil)
MDP0040
EL5364IUZA
5364IUZ
16 Ld QSOP (150 mil)
MDP0040
EL5364IUZA-T7 (Note 1)
5364IUZ
16 Ld QSOP (150 mil)
MDP0040
EL5364IUZA-T13 (Note 1)
5364IUZ
16 Ld QSOP (150 mil)
MDP0040
NOTES:
1. Please refer to TB347 for details on reel specifications.
2. These Intersil Pb-free plastic packaged products employ special Pb-free material sets, molding compounds/die attach materials, and 100% matte
tin plate plus anneal (e3 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free soldering operations). Intersil
Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020.
3. For Moisture Sensitivity Level (MSL), please see product information page for EL5164, EL5165, EL5364. For more information on MSL, please see
tech brief TB363.
4. The part marking is located on the bottom of the part.
FN7389 Rev 9.00
January 30, 2014
Page 2 of 17
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