DAC08CSZ-REEL データシートの表示（PDF） - Analog Devices

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DAC08CSZ-REEL

8-Bit, High Speed, Multiplying D/A Converter

Analog Devices 

Data Sheet

ABSOLUTE MAXIMUM RATINGS

Table 3.

Parameter

Operating Temperature

DAC08AQ, DAC08Q

DAC08HQ, DAC08EQ, DAC08CQ

DAC08CP, DAC08CS

Junction Temperature (TJ)

Storage Temperature Q Package

Storage Temperature P Package

Lead Temperature (Soldering, 60 sec)

V+ Supply to V− Supply

Logic Inputs

VLC

Analog Current Outputs (at VS− = 15 V)

Reference Input (V14 to V15)

Reference Input Differential Voltage

(V14 to V15)

Reference Input Current (I14)

Rating

−55°C to +125°C

0°C to +70°C

−40°C to +85°C

−65°C to +150°C

−65°C to +150°C

−65°C to +125°C

300°C

36 V

V− to V− + 36 V

V− to V+

4.25 mA

V− to V+

±18 V

5.0 mA

Stresses at or above those listed under Absolute Maximum

Ratings may cause permanent damage to the product. This is a

stress rating only; functional operation of the product at these

or any other conditions above those indicated in the operational

section of this specification is not implied. Operation beyond

the maximum operating conditions for extended periods may

affect product reliability.

DAC08

THERMAL RESISTANCE

θJA is specified for worst case mounting conditions, that is, θJA is

specified for device in socket for CERDIP, PDIP, and LCC

packages; θJA is specified for device soldered to printed circuit

board for SOIC package.

Table 4. Thermal Resistance

Package Type

θJA

16-Lead CERDIP (Q)

100

16-Lead PDIP (P)

82

20-Terminal LCC (RC)

76

16-Lead SOIC (S)

111

θJC

Unit

16

°C/W

39

°C/W

36

°C/W

35

°C/W

ESD CAUTION

Rev. D | Page 5 of 21

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