HEC4040BT,118 データシートの表示（PDF） - NXP Semiconductors.
部品番号
コンポーネント説明
メーカー
HEC4040BT,118 Datasheet PDF : 14 Pages
| |||
NXP Semiconductors
12. Package outline
DIP16: plastic dual in-line package; 16 leads (300 mil)
HEF4040B
12-stage binary ripple counter
SOT38-4
D
L
Z
e
b
16
pin 1 index
A2 A
A1
wM
b1
b2
9
ME
c
(e 1)
MH
E
1
8
0
5
10 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
UNIT
A
max.
A1
min.
A2
max.
b
b1
b2
c
D (1)
E (1)
e
e1
L
ME
MH
w
Z (1)
max.
mm
4.2
0.51
3.2
1.73
1.30
0.53
0.38
1.25
0.85
0.36 19.50 6.48
0.23 18.55 6.20
2.54
7.62
3.60
3.05
8.25
7.80
10.0
8.3
0.254
0.76
inches 0.17
0.02
0.13
0.068 0.021 0.049 0.014
0.051 0.015 0.033 0.009
0.77
0.73
0.26
0.24
0.1
0.3
0.14
0.12
0.32
0.31
0.39
0.33
0.01
0.03
Note
1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included.
OUTLINE
VERSION
IEC
SOT38-4
REFERENCES
JEDEC
JEITA
EUROPEAN
PROJECTION
ISSUE DATE
95-01-14
03-02-13
Fig 7. Package outline SOT38-4 (DIP16)
HEF4040B
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 8 — 17 November 2011
© NXP B.V. 2011. All rights reserved.
9 of 14
Share Link: 