LH28F160BG-TL/BGH-TL
PIN DESCRIPTION
SYMBOL
TYPE
NAME AND FUNCTION
A0-A19
INPUT
ADDRESS INPUTS : Inputs for addresses during read and write operations. Addresses
are internally latched during a write cycle.
DATA INPUT/OUTPUTS : Inputs data and commands during CUI write cycles; outputs
DQ0-DQ15 INPUT/ data during memory array, status register and identifier code read cycles. Data pins float
OUTPUT to high-impedance when the chip is deselected or outputs are disabled. Data is
internally latched during a write cycle.
CE#
RP#
OE#
WE#
WP#
RY/BY#
VPP
VCC
GND
NC
INPUT
INPUT
INPUT
INPUT
INPUT
CHIP ENABLE : Activates the device’s control logic, input buffers, decoders and sense
amplifiers. CE#-high deselects the device and reduces power consumption to standby
levels.
RESET/DEEP POWER-DOWN : Puts the device in deep power-down mode and resets
Y internal automation. RP#-high enables normal operation. When driven low, RP# inhibits
write operations which provide data protection during power transitions. Exit from deep
power-down sets the device to read array mode. Block erase or word write with VIH <
R RP# < VHH produce spurious results and should not be attempted.
OUTPUT ENABLE : Gates the device’s outputs during a read cycle.
A WRITE ENABLE : Controls writes to the CUI and array blocks. Addresses and data are
latched on the rising edge of the WE# pulse.
WRITE PROTECT : Master control for boot blocks locking. When VIL, locked boot
N blocks cannot be erased and programmed.
I READY/BUSY : Indicates the status of the internal WSM. When low, the WSM is
OUTPUT
I M SUPPLY
E L SUPPLY
P RSUPPLY
performing an internal operation (block erase or word write). RY/BY#-high-impedance
indicates that the WSM is ready for new commands, block erase is suspended, and
word write is inactive, word write is suspended, or the device is in deep power-down
mode.
BLOCK ERASE AND WORD WRITE POWER SUPPLY : For erasing array blocks or
writing words. With VPP ≤ VPPLK, memory contents cannot be altered. Block erase and
word write with an invalid VPP (see Section 6.2.3 "DC CHARACTERISTICS") produce
spurious results and should not be attempted.
DEVICE POWER SUPPLY : 2.7 to 3.6 V. Do not float any power pins. With VCC ≤
VLKO, all write attempts to the flash memory are inhibited. Device operations at invalid
VCC voltage (see Section 6.2.3 "DC CHARACTERISTICS") produce spurious results
and should not be attempted.
GROUND : Do not float any ground pins.
NO CONNECT : Lead is not internal connected; recommend to be floated.
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