BSP 319
Maximum Ratings
Parameter
Chip or operating temperature
Storage temperature
Thermal resistance, chip to ambient air
Thermal resistance, junction-soldering point 1)
DIN humidity category, DIN 40 040
IEC climatic category, DIN IEC 68-1
Symbol
Tj
Tstg
RthJA
R thJS
1) Transistor on epoxy pcb 40 mm x 40 mm x 1,5 mm with 6 cm2 copper area for drain connection
Values
Unit
-55 ... + 150 ˚C
-55 ... + 150
≤ 70
K/W
≤ 10
E
55 / 150 / 56
Electrical Characteristics, at Tj = 25˚C, unless otherwise specified
Parameter
Symbol
Values
Unit
min.
typ.
max.
Static Characteristics
Drain- source breakdown voltage
VGS = 0 V, ID = 0.25 mA, Tj = 0 ˚C
Gate threshold voltage
VGS=VDS, ID = 1 mA
Zero gate voltage drain current
VDS = 50 V, VGS = 0 V, Tj = 25 ˚C
VDS = 50 V, VGS = 0 V, Tj = 125 ˚C
Gate-source leakage current
VGS = 20 V, VDS = 0 V
Drain-Source on-state resistance
VGS = 5 V, ID = 2.4 A
V(BR)DSS
50
VGS(th)
1.2
IDSS
-
-
IGSS
-
RDS(on)
-
V
-
-
1.6
2
µA
0.1
1
10
100
nA
10
100
Ω
0.06
0.07
Data Sheet
2
05.99