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CS5206-1GDP3(2006) データシートの表示(PDF) - ON Semiconductor

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CS5206-1GDP3
(Rev.:2006)
ON-Semiconductor
ON Semiconductor ON-Semiconductor
CS5206-1GDP3 Datasheet PDF : 9 Pages
1 2 3 4 5 6 7 8 9
CS52061, CS52063, CS52065
VOUT
VIN
Thermal
Shutdown
Output
Current
Limit
+ Error
Amplifier
Bandgap
Gnd
Figure 2. Block Diagram CS52062, 3
MAXIMUM RATINGS*
Parameter
Value
Unit
Supply Voltage, VCC
Operating Temperature Range
17
V
40 to +70
°C
Junction Temperature
150
°C
Storage Temperature Range
60 to +150 °C
Lead Temperature Soldering:
Wave Solder (through hole styles only) Note 1
Reflow (SMD styles only) Note 2
260 Peak
230 Peak
°C
1. 10 second maximum.
2. 60 second maximum above 183°C.
*The maximum package power dissipation must be observed.
ELECTRICAL CHARACTERISTICS (CIN = 10 μF, COUT = 22 μF, Tantalum, VIN VOUT = 3.0 V, VIN 15 V, 0°C TA 70°C,
TJ = +150°C, unless otherwise specified, Ifull load = 6.0 A.)
Characteristic
Test Conditions
Min
Typ
Max
Unit
Adjustable Output Voltage (CS52061)
Reference Voltage (Notes 3 and 4)
Line Regulation
Load Regulation (Notes 3 and 4)
Dropout Voltage (Note 5)
Current Limit
VIN VOUT = 1.5 V; VAdj = 0 V,
10 mA IOUT 6.0 A
1.5 V VIN VOUT 6.0 V; IOUT = 10 mA
VIN VOUT = 1.5 V; 10 mA IOUT 6.0 A
IOUT = 6.0 A
VIN VOUT = 3.0 V; TJ 25°C
VIN VOUT = 9.0 V
1.241
1.254
1.266
V
(1%)
(+1%)
0.04
0.20
%
0.1
0.4
%
1.3
1.4
V
6.5
8.5
6.0
A
1.0
A
Minimum Load Current
Adjust Pin Current
VIN VOUT = 7.0 V
1.2
100
mA
50
5.0
μA
Adjust Pin Current Change
1.5 V VIN VOUT 4.0 V;
10 mA IOUT 6.0 A
0.2
μA
Thermal Regulation
30 ms pulse; TA = 25°C
0.003
%/W
3. Load regulation and output voltage are measured at a constant junction temperature by low duty cycle pulse testing. Changes in output
voltage due to thermal gradients or temperature changes must be taken into account separately.
4. Specifictions apply for an external Kelvin sense connection atr a point on the output pin 1/4” from the bottom of the package.
5. Dropout voltage is a measurement of the minimum input/output differentail at full load.
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