CS5206-1GDP3(2006) データシートの表示（PDF） - ON Semiconductor

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CS5206-1GDP3
(Rev.:2006)

6.0 A Adjustable, and Fixed 3.3 V and 5.0 V Linear Regulators

ON Semiconductor 

CS5206−1, CS5206−3, CS5206−5

temperatures accurately to ensure that an adequate heat sink

is used.

The case is connected to VOUT on the CS5206−X,

electrical isolation may be required for some applications.

Thermal compound should always be used with high current

regulators such as these.

The thermal characteristics of an IC depend on the

following four factors:

1. Maximum Ambient Temperature TA (°C)

2. Power dissipation PD (Watts)

3. Maximum junction temperature TJ (°C)

4. Thermal resistance junction to ambient RΘJA (°C/W)

These four are related by the equation

TJ + TA ) PD RQJA

(1)

The maximum ambient temperature and the power

dissipation are determined by the design while the

maximum junction temperature and the thermal resistance

depend on the manufacturer and the package type.

The maximum power dissipation for a regulator is:

PD(max) + {VIN(max) * VOUT(min)}IOUT(max) ) VIN(max)IQ

(2)

where:

VIN(max) is the maximum input voltage,

VOUT(min) is the minimum output voltage,

IOUT(max) is the maximum output current, for the application

IQ is the maximum quiescent current at IOUT(max).

A heat sink effectively increases the surface area of the

package to improve the flow of heat away from the IC and

into the surrounding air.

Each material in the heat flow path between the IC and the

outside environment has a thermal resistance. Like series

electrical resistances, these resistances are summed to

determine RΘJA, the total thermal resistance between the

junction and the surrounding air.

1. Thermal Resistance of the junction to case, RΘJC

(°C/W)

2. Thermal Resistance of the case to Heat Sink, RΘCS

(°C/W)

3. Thermal Resistance of the Heat Sink to the ambient

air, RΘSA (°C/W)

These are connected by the equation:

RQJA + RQJC ) RQCS ) RQSA

(3)

The value for RΘJA is calculated using equation (3) and

the result can be substituted in equation (1).

The value for RΘJC is normally quoted as a single figure

for a given package type based on an average die size. For

a high current regulator such as the CS5206−X the majority

of the heat is generated in the power transistor section. The

value for RΘJSA depends on the heat sink type, while RΘJCS

depends on factors such as package type, heat sink interface

(is an insulator and thermal grease used?), and the contact

area between the heat sink and the package. Once these

calculations are complete, the maximum permissible value

of RΘJA can be calculated and the proper heat sink selected.

For further discussion on heat sink selection, see application

note “Thermal Management,” document number

AND8036/D, available through the Literature Distribution

Center or via our website at http://onsemi.com.

ORDERING INFORMATION

Orderable Part Number

Type

Package

Shipping†

CS5206−1GT3

CS5206−1GDP3

CS5206−1GDPR3

CS5206−3GT3

CS5206−3GDP3

CS5206−3GDPR3

CS5206−5GT3

6.0 A, Adj. Output

6.0 A, Adj. Output

6.0 A, Adj. Output

6.0 A, 3.3 V Output

6.0 A, 3.3 V Output

6.0 A, 3.3 V Output

6.0 A, 5.0 V Output

TO−220−3, Straight

D2PAK−3

D2PAK−3

TO−220−3, Straight

D2PAK−3

D2PAK−3

TO−220−3, Straight

50 Units/Rail

50 Units/Rail

750 Tape & Reel

50 Units/Rail

50 Units/Rail

750 Tape & Reel

50 Units/Rail

†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging

Specifications Brochure, BRD8011/D.

http://onsemi.com

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