FAN5350 データシートの表示（PDF） - ON Semiconductor

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FAN5350

3MHz, 600mA Step-Down DC-DC Converter in Chip-Scale and MLP Packaging

ON Semiconductor 

FAN5350

3MHz, 600mA Step-Down DC-DC Converter in

Chip-Scale and MLP Packaging

Features

 3MHz Fixed-Frequency Operation

 16µA Typical Quiescent Current

 600mA Output Current Capability

 2.7V to 5.5V Input Voltage Range

 1.82V Fixed Output Voltage

 Synchronous Operation

 Pow er-Save Mode

 Soft-Start Capability

 Input Under-Voltage Lockout (UVLO)

 Thermal Shutdow n and Overload Protection

 6-Lead 3 x 3mm MLP

 5-Bump 1 x 1.37mm WLCSP

Applications

 Cell Phones, Smart-Phones

 Pocket PCs

 WLAN DC-DC Converter Modules

 PDA, DSC, PMP, and MP3 Players

 Portable Hard Disk Drives

Description

The FAN5350 is a step-dow n sw itching voltage regulator

that delivers a f ixed 1.82V f rom an input voltage supply of

2.7V to 5.5V. Using a proprietary architecture w ith

synchronous rectification, the FAN5350 is capable of

delivering 600mA at over 90% efficiency, w hile

maintaining a very high efficiency of over 80% at load

currents as low as 1mA. The regulator operates at a

nominal fixed frequency of 3MHz at full load, w hich

reduces the value of the external components to 1µH for

the output inductor and 4.7µF for the output capacitor.

At moderate and light loads, pulse frequency modulation is

used to operate the device in pow er-save mode w ith a

typical quiescent current of 16µA. Even w ith such a low

quiescent current, the part exhibits excellent transient

response during large load sw ings. At higher loads, the

system automatically sw itches to fixed-frequency control,

operating at 3MHz. In shutdow n mode, the supply current

drops below 1µA, reducing pow er consumption.

The FAN5350 is available in a 6-lead Molded Leadless

Package (MLP) and a 5-bump Wafer Level Chip Scale

Package (WLCSP).

Ordering Information

Part Number

Operating

Temperature

Range

FAN5350UCX

-40°C to 85°C

FAN5350MPX

-40°C to 85°C

Package

5-Ball, Type-1 WL-CSP, 1x1.37mm,

.5mm Pitch

6-Lead, Molded Leadless Package

(MLP), Dual, JEDEC MO-229, 3mm

Square, Extended DAP

© 2007 Semiconductor Components Industries, LLC.

October-2017, Rev . 2

Eco Packing Method

Status

Green

Tape and Reel

Green

Tape and Reel

Publication Order Number:

FAN5350/D

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