FAN5631(2006) データシートの表示（PDF） - Fairchild Semiconductor

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FAN5631
(Rev.:2006)

Regulated Step-Down Charge Pump DC/DC Converter

Fairchild Semiconductor 

Absolute Maximum Ratings (Note1)

Parameter

VIN to GND

All other pins to GND

Load Current

Thermal Resistance-Junction to Tab (θJC), 3mmx3mm 10-lead MLP (Note 2)

Lead Soldering Temperature (10 seconds)

Storage Temperature

Junction Temperature

Electrostatic Discharge (ESD) Protection Level (Note 3)

HBM

CDM

Min

-0.3

-0.3

-65

-40

2.5

2

Max

6

VIN + 0.3V

0.5

8

260

150

150

Unit

V

V

A

°C/W

°C

°C

°C

kV

Recommended Operating Conditions

Parameter

Supply Voltage Range

Output Current (VIN > 2.7V)

Operating Ambient Temperature Range

Min

2.2

-40

Typ

25

Max

5.5

250

+85

Unit

V

mA

°C

Notes:

1. Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This

is a stress rating only and functional operation of the device at these or any other conditions above those indicated

in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for

extended periods may affect device reliability. Absolute maximum ratings apply individually only, not in combination.

Unless otherwise specified, all other voltages are referenced to AGND.

2. Junction to ambient thermal resistance, θJA, is a strong function of PCB material, board thickness, thickness and

number of copper planes, number of via used, diameter of via used, available copper surface, and attached heat

sink characteristics. The estimated value for zero air flow at 0.5W is 60°C/W.

3. Using Mil Std. 883E, method 3015.7(Human Body Model) and EIA/JESD22C101-A (Charge Device Model).

3

FAN5631/FAN5632 Rev. 1.0.2

www.fairchildsemi.com

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