HMC129 データシートの表示（PDF） - Micross Components

部品番号

コンポーネント説明

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HMC129

GaAs MMIC DOUBLE-BALANCED MIXER, 4 - 8 GHz

Micross Components 

v04.1007

MxN Spurious @ IF Port

mRF

0

1

0

xx

13.66

1

8.16

0

2

78.5

80.16

3

76.0

80.0

4

73.83 77.83

RF Freq. = 6.1 GHz @ -10 dBm

LO Freq. = 6.0 GHz @ +13 dBm

Measured as downconverter

nLO

2

26.83

31.33

75.16

81.16

80.0

3

9.16

49.33

79.16

64.5

81.83

4

38.33

43.5

76.66

78.66

82.0

Outline Drawing

HMC129

GaAs MMIC DOUBLE-BALANCED

MIXER, 4 - 8 GHz

Absolute Maximum Ratings

LO Drive

Storage Temperature

Operating Temperature

+27 dBm

-65 to +150 °C

-55 to +85 °C

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/"3%26%(!.$,).'02%#!54)/.3

4

Die Packaging Information [1]

Standard

Alternate

WP-3 (Waffle Pack)

[2]

[1] Refer to the “Packaging Information” section for die

packaging dimensions.

[2] For alternate packaging information contact Hittite

Microwave Corporation.

NOTES:

1. ALL DIMENSIONS ARE IN INCHES [MM]

2. BOND PADS ARE .004” SQUARE

3. TYPICAL BOND PAD SPACING CENTER TO CENTER

.1 IS .006” EXCEPT AS SHOWN

4. DIE THICKNESS = .004” [.100 MM]

5. BACKSIDE METALIZATION: GOLD

6. BACKSIDE METAL IS GROUND

7. BOND PAD METALIZATION: GOLD

For price, delivery, and to place orders, please contact Hittite Microwave Corporation:

20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373

Order On-line at www.hittite.com

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