IRF9541 データシートの表示（PDF） - Harris Semiconductor
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IRF9541 Datasheet PDF : 11 Pages
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IRF9540, IRF9541, IRF9542, IRF9543, RF1S9540, RF1S9540SM
TO-262AA
3 LEAD JEDEC TO-262AA PLASTIC PACKAGE
E
15o
A
H1
D
L1
L
b1
c
b
60o
123
e
J1
e1
A1
TERM. 4
INCHES
MILLIMETERS
SYMBOL MIN
MAX
MIN
MAX NOTES
A
0.170
0.180
4.32
4.57
-
A1
0.048
0.052
1.22
1.32
3, 4
b
0.030
0.034
0.77
0.86
3, 4
b1
0.045
0.055
1.15
1.39
3, 4
c
0.018
0.022
0.46
0.55
3, 4
D
0.405
0.425 10.29
10.79
-
E
0.395
0.405 10.04
10.28
-
e
0.100 TYP
2.54 TYP
5
e1
0.200 BSC
5.08 BSC
5
H1
0.045
0.055
1.15
1.39
-
J1
0.095
0.105
2.42
2.66
6
L
0.530
0.550 13.47
13.97
-
L1
0.110
0.130
2.80
3.30
2
NOTES:
1. These dimensions are within allowable dimensions of Rev. A of
JEDEC TO-262AA outline dated 6-90.
2. Solder finish uncontrolled in this area.
3. Dimension (without solder).
4. Add typically 0.002 inches (0.05mm) for solder plating.
5. Position of lead to be measured 0.250 inches (6.35mm) from bottom
of dimension D.
6. Position of lead to be measured 0.100 inches (2.54mm) from bottom
of dimension D.
7. Controlling dimension: Inch.
8. Revision 4 dated 10-95.
10
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