RF1S9540 データシートの表示（PDF） - Harris Semiconductor
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RF1S9540 Datasheet PDF : 11 Pages
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IRF9540, IRF9541, IRF9542, IRF9543, RF1S9540, RF1S9540SM
TO-263AB
SURFACE MOUNT JEDEC TO-263AB PLASTIC PACKAGE
E
H1
D
L
1
3
b
e
e1
TERM. 4
L2
b1
A
A1
TERM. 4
L1
c
J1
.450
(11.43)
b2
3
1
L3
.700
(17.78)
.350
(8.89)
.150
(3.81)
.080(2.03)
.080(2.03)
.062(1.58)
.062(1.58)
MINIMUM PAD SIZE RECOMMENDED FOR
SURFACE-MOUNTED APPLICATIONS
INCHES
MILLIMETERS
SYMBOL MIN
MAX
MIN
MAX NOTES
A
0.170
0.180
4.32
4.57
-
A1
0.048
0.052
1.22
1.32
4, 5
b
0.030
0.034
0.77
0.86
4, 5
b1
0.045
0.055
1.15
1.39
4, 5
b2
0.310
-
7.88
-
2
c
0.018
0.022
0.46
0.55
4, 5
D
0.405
0.425 10.29
10.79
-
E
0.395
0.405 10.04
10.28
-
e
0.100 TYP
2.54 TYP
7
e1
0.200 BSC
5.08 BSC
7
H1
0.045
0.055
1.15
1.39
-
J1
0.095
0.105
2.42
2.66
-
L
0.175
0.195
4.45
4.95
-
L1
0.090
0.110
2.29
2.79
4, 6
L2
0.050
0.070
1.27
1.77
3
L3
0.315
-
8.01
-
2
NOTES:
1. These dimensions are within allowable dimensions of Rev. C of
JEDEC TO-263AB outline dated 2-92.
2. L3 and b2 dimensions established a minimum mounting surface
for terminal 4.
3. Solder finish uncontrolled in this area.
4. Dimension (without solder).
5. Add typically 0.002 inches (0.05mm) for solder plating.
6. L1 is the terminal length for soldering.
7. Position of lead to be measured 0.120 inches (3.05mm) from bottom
of dimension D.
8. Controlling dimension: Inch.
9. Revision 7 dated 10-95.
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