CD4017BMS データシートの表示（PDF） - Renesas Electronics

部品番号

コンポーネント説明

メーカー

CD4017BMS

CMOS Counter/Dividers

Renesas Electronics 

CD4017BMS, CD4022BMS

Chip Dimensions and Pad Layouts

CD4017BMSH

FN3297 Rev 0.00

August 1998

Dimensions in parentheses are in millimeters

and are derived from the basic inch dimensions

as indicated. Grid graduations are in mils (10-3 inch)

CD4022BMSH

METALLIZATION: Thickness: 11kÅ 14kÅ, AL.

PASSIVATION: 10.4kÅ - 15.6kÅ, Silane

BOND PADS: 0.004 inches X 0.004 inches MIN

DIE THICKNESS: 0.0198 inches - 0.0218

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