CHA5390TBF データシートの表示（PDF） - United Monolithic Semiconductors

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CHA5390TBF

24-30GHz Medium Power Amplifier

United Monolithic Semiconductors 

CHA5390TBF

24-30GHz Medium Power Amplifier

The RF ports comprise a DC blocking capacitor on chip level. The DC connections

include a first level of DC decoupling capacitors (typically 120pF) in the package.

However, all DC bias ports should be additionally connected to ground with 10nF

capacitors at board level to prevent the MMIC from oscillations. These parts should

be placed close to the SMD leadless package. If the same bias is required at

different DC ports, the lines should only be connected behind these block capacitors.

Further information on the application of the SMD leadless packages for GaAs

monolithic microwave ICs are given in the UMS Application Note AN0005.

Ordering Information

SMD leadless package form :

CHA5390TBF/24

Information furnished is believed to be accurate and reliable. However United Monolithic Semiconductors

S.A.S. assumes no responsability for the consequences of use of such information nor for any infringement of

patents or other rights of third parties which may result from its use. No license is granted by implication or

otherwise under any patent or patent rights of United Monolithic Semiconductors S.A.S.. Specifications

mentioned in this publication are subject to change without notice. This publication supersedes and replaces all

information previously supplied. United Monolithic Semiconductors S.A.S. products are not authorised for use

as critical components in life support devices or systems without express written approval from United

Monolithic Semiconductors S.A.S.

Ref. : DSCHA5390TBF2249 -06-Sept.-02

6/6

Specifications subject to change without notice

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