EL2450CN データシートの表示（PDF） - Renesas Electronics
部品番号
コンポーネント説明
メーカー
EL2450CN Datasheet PDF : 15 Pages
| |||
EL2250, EL2450
Typical Performance Curves (Continued)
Supply Current vs Supply Voltage
(per amplifier)
Supply Current vs Die
Temperature (per amplifier)
Input Resistance vs Die
Temperature
Offset Voltage vs Die Temperature
(4 Samples)
Input Bias Current vs Input Voltage
Input Offset Current and Input Bias
Current vs Die Temperature
Positive Output Voltage Swing vs
Die Temperature, RL = 150 to
GND
Negative Output Voltage Swing vs
Die Temperature, RL = 150 to
GND
Channel to Channel Isolation vs
Frequency
Package Power Dissipation vs Ambient Temp.
SEMI G42-88 Single Layer Test Board
1.8
1.6 1.54W
1.4 1.25W
1.2
JA =P8D1°IPC1/W4
1
0.8
0.6
JA =1P0D0I°PC8/W
0.4
0.2
0
0
25
50
75 85 100 125 150
Ambient Temperature (°C)
FN7061 Rev 3.00
May 19, 2006
Package Power Dissipation vs Ambient Temp.
JEDEC JESD51-3 Low Effective Thermal Conductivity
Test Board
1.2
1.042W
1
0.8
0.6
0.4
781W SO8 JA =S1O6104°CJ/AW=120°C/W
0.2
0
0
25
50
75 85 100 125 150
Ambient Temperature (°C)
Page 9 of 15
Share Link: 