CS3717A データシートの表示（PDF） - ON Semiconductor
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CS3717A Datasheet PDF : 8 Pages
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Application Circuit - Two Phase Bipolar Stepper Motor Driver
FROM
µ PROCESSOR
0.1µF C3 VSS
VS
RT
56kΩ
RT
56kΩ
C1 100µF
C2
0.1µF
VREF VCC
IN1
VDDB VDDA
OUTA
MAA
IN0
CCSS3-731771A7A
DIRECTION
Pulse
Gnd Gnd COMP IN
OUTB
Sense
MBA
RC
1kΩ
CT
CC
1Ω
IMA
820pF
820pF
RSense
CT
820pF
CC
820pF
RC
1Ω
RSense
Pulse
Gnd
DIRECTION
1kΩ
Gnd Comp In
Sense
Out B
IN1
CS3717A
IN0
VREF
VCC
VDDB
OutA
VDDA
IMB
STEPPER
MOTOR
Mounting Instructions
The RΘJA of the CS3717A can be reduced by soldering the
Gnd pins to a suitable copper area of the printed circuit
board or to an external heatsink.
The diagram of fig. 2 shows the maximum dissipated
power Ptot and the RΘJA as a function of the side “l ” of
two equal square copper areas having a thickness of 35µ
(see fig. 1). In addition, it is possible to use an external
heatsink (see fig. 3). During soldering the pins tempera-
ture must not exceed 260°C and the soldering time must
not be longer than 12 seconds.
The external heatsink or printed circuit copper area must
be connected to electrical ground.
COPPER AREA 35µ THICKNESS
Ptot
(W)
4
3
Rθ JA
Rθ JA
(˚C/W)
80
60
l
l
P.C. BOARD
Figure 1 - Example of P.C. Board Copper Area Which is Used as
Heatsink with 16 lead fused package.
170mm
11.9mm
38.0mm
2
40
1
Ptot (Tamb = 70˚C)
20
0
0
0
10
20
30
40 I(mm)
“l”
Figure 2 - Max. Power Dissipation And Junction To Ambient Thermal
Resistance vs. Size “l” for 16 lead fused package.
Ptot
(W)
5
4
3
2
1
0
-50
HEAT - SINK WITH Rth = 25˚C/W
FREE AIR
0
50
100
Tamb (C)
Figure 3 - External Heatsink Mounting Example (Rth = 30°C/W) for 16
lead batwing package.
Figure 4 - Maximum Allowable Power Dissipation vs. Ambient
Temperature for 16 lead batwing package.
7
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