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FSA2257 データシートの表示(PDF) - ON Semiconductor

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FSA2257 Datasheet PDF : 12 Pages
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THIS DRAWING IS THE PROPERTY OF FAIRCHILD SEMICONDUCTOR CORPORATION. NO USE
THEREOF SHALL BE MADE OTHER THAN AS A REFERENCE FOR PROPOSALS AS SUBMITTED
TO FAIRCHILD SEMICONDUCTOR CORPORATION FOR JOBS TO BE EXECUTED IN CONFORMITY
WITH SUCH PROPOSALS UNLESS THE CONSENT OF SAID FAIRCHILD SEMICONDUCTOR COR-
PORATION HAS PREVIOUSLY BEEN OBTAINED. NO PART OF THIS DRAWING SHALL BE
COPIED OR DUPLICATED OR ITS CONTENTS DISCLOSED. THE INFORMATION CONTAINED
ON THIS DRAWING IS CONFIDENTIAL AND PROPRIETARY.
3.00±0.10
2.45
A
B
4.90
3.00±0.10
REVISIONS
NBR
DESCRIPTION
DATE BY/APP'D
B
REDREW FORMER NSC DWG
07JUN2006
H.ALLEN
2
* REMOVE SITE ADDRESS AND CHANGE REVISION
TO NUMERICAL & CHANGED LAND PATTERN TO IPC.
* CHANGE LEAD WIDTH FROM 0.27MAX TO 0.33MAX.
* REMOVE DATE OF JEDEC REVISION
20AUG2009 KHLEE/FSSZ
3
* REVERT LEAD WIDTH TO 0.27MAX.
24SEP2009 KHLEE/FSSZ
1.40 MIN
10
0.30
6
4.40
PIN #1 ID
QUADRANT
0.381
1
5
TOP VIEW
1
5
0.50
LAND PATTERN RECOMMENDATION
0.85±0.10
A
1.10 MAX
0.15
0.00
0.10 C
ALL LEAD TIPS
0.50
SIDE VIEW
C
0.27
0.17
.08 M A B C
0.23
0.08
END VIEW
12°
TOP & BOTTOM
GAUGE
PLANE
R0.13 TYP
SEATING
PLANE
NOTES: UNLESS OTHERWISE SPECIFIED
A. THIS PACKAGE CONFORMS TO JEDEC MO-187
VARIATION BA.
B. ALL DIMENSIONS ARE IN MILLIMETERS.
C. DIMENSIONS ARE EXCLUSIVE OF BURRS,
MOLD FLASH AND TIE BAR EXTRUSIONS.
D. DIMENSIONS AND TOLERANCES AS PER ASME
Y14.5-1994.
E. LAND PATTERN AS PER IPC7351#SOP50P490X110-10AN
F. FILE NAME: MKT-MUA10AREV3
0.22
APPROVALS
DRAWN:
BOBOY MALDO
CHECKED: KH LEE
APPROVED: BY HUANG
APPROVED:
HOWARD ALLEN
PROJECTION
[MM]
INCH
4°-8
0.80
0.40
0.95
DETAIL A
SCALE 20 : 1
DATE
24SEP09
10LD, MSOP, JEDEC
MO-187, 3.0MM WIDE
.
SCALE
SIZE
DRAWING NUMBER
REV
1:1 N/A MKT-MUA10A 3
FORMERLY: N/A
SHEET : 1 OF 1

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