HCS74D データシートの表示（PDF） - Intersil

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HCS74D

Radiation Hardened Dual-D Flip-Flop with Set and Reset

Intersil 

Die Characteristics

DIE DIMENSIONS:

89 x 88 mils

2.25 x 2.24mm

METALLIZATION:

Type: AlSi

Metal Thickness: 11kÅ ± 1kÅ

GLASSIVATION:

Type: SiO2

Thickness: 13kÅ ± 2.6kÅ

WORST CASE CURRENT DENSITY:

<2.0 x 105A/cm2

BOND PAD SIZE:

100µm x 100µm

4 x 4 mils

Metallization Mask Layout

D1

(2)

CP1 (3)

HCS74MS

HCS74MS

R1

(1)

VCC

(14)

NC

S1 (4)

Q1 (5)

Q1 (6)

(7)

(8)

(9)

GND

Q2

Q2

91

(13) R2

(12) D2

NC

(11) CP2

(10) S2

Spec Number 518772

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