NDT455N データシートの表示（PDF） - Fairchild Semiconductor
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NDT455N Datasheet PDF : 10 Pages
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Typical Thermal Characteristics
40
V DS =10V
30
20
TJ = -55°C
25°C
125°C
10
0
0
6
12
18
24
30
ID, DRAIN CURRENT (A)
Figure 13. Transconductance Variation with Drain
Current and Temperature.
3.5
3
2.5
2
1.5
1b
1c
1
0.5
0
1a
4.5"x5" FR-4 Board
TA = 25o C
Still Air
0.2
0.4
0.6
0.8
1
2oz COPPER MOUNTING PAD AREA (in 2 )
Figure 14. SOT-223 Maximum Steady- State
Power Dissipation versus Copper
Mounting Pad Area.
14
12
1a
10
8
1b
1c
6
4
0
4.5"x5" FR-4 Board
o
TA = 25 C
Still Air
VGS = 10V
0.2
0.4
0.6
0.8
1
2oz COPPER MOUNTING PAD AREA (in2 )
Figure 15. Maximum Steady-State
DrainCurrent versus Copper Mounting
Pad Area.
60
30
10
RDS(ON) LIMIT
5
1
VGS = 10V
0.1 SINGLE PULSE
0.05 RθJA =See Note1c
TA = 25°C
100us
1ms
10ms
1s100ms
10s
DC
0.01
0.1
0.5 1
2
5
10
VDS , DRAIN-SOURCE VOLTAGE (V)
30 50
Figure 16. Maximum Safe Operating Area.
1
0.5
D = 0.5
0.2
0.1
0.05
0.2
0.1
0.05
0.02
0.01
0.005
0.002
0.001
0.0001
0.02
0.01
Single Pulse
0.001
0.01
0.1
1
t 1 , TIME (sec)
R θJA (t) = r(t) * R θJA
R θJA = See Note 1 c
P(pk)
t1
t2
TJ - TA = P * R θJA (t)
Duty Cycle, D = t1 / t2
10
100
300
Figure 17. Typical Transient Thermal Impedance Curve.
Remark: Thermal characterization performed under the conditions of Note 1c. Should better thermal design employs, RθJA will be
lower and reach thermal equivalent sooner.
NDT455N Rev.F
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