NBB-301 データシートの表示（PDF） - Unspecified
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NBB-301 Datasheet PDF : 5 Pages
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Cascadable Broadband GaAs MMIC Amplifier
Package Drawing 4-Lead Ceramic Micro-X
6000027 Rev. A
45°
0.055
(1.40)
1
UNITS:
INCHES
1
(mm)
0.040
(1.02)
2
4
0.070
(1.78)
3
0.020
0.200 sq
(5.08)
0.005
(0.13)
Application Notes
Die Attach:
The die attach process mechanically attaches the die to the circuit substrate. In addition, it electrically
connects the ground to the trace on which the chip is mounted, and establishes the thermal path by
which heat can leave the chip.
Wire Bonding:
Electrical connections to the chip are made through wire bonds. Either wedge or ball bonding methods
are acceptable practices for wire bonding.
1
Assembly Procedure:
Epoxy or eutectic die attach are both acceptable attachment methods. Top and bottom metalization are
gold. Conductive silver-filled epoxies are recommended. This procedure involves the use of epoxy to
form a joint between the backside gold of the chip and the metalized area of the substrate. A 150°C cure
for 1 hour is necessary. Recommended epoxy is Ablebond 84-1LMI from Ablestik.
Bonding Temperature (Wedge or Ball):
It is recommended that the heater block temperature be set 160°C +/- 10°C.
ESD Sensitive Device
RF Nitro Communications has furnished the information contained within this document to the best of our ability and accuracy.
However, we reserve the right to make changes to our products, and supporting data, at our sole discretion without notice.
1-14 10420-F Harris Oaks Blvd., Charlotte, NC 28269 Phone: (704) 596-9060 Fax: (704) 596-0950 Web: www.rfnitro.com
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