SCOTTSDALE DIVISION
MMAD1106 and MMAD1106e3
Switching Diode Array
Steering Diode TVS Array™
DESCRIPTION
APPEARANCE
These low capacitance diode arrays are multiple, discrete, isolated junctions
fabricated by a planar process and mounted in a 14-pin package for use as
steering diodes protecting up to eight I/O ports from negative ESD, EFT, or
surge by directing them to ground (pin 14)*. They may also be used in fast
switching core-driver applications. This includes computers and peripheral
equipment such as magnetic cores, thin-film memories, plated-wire
memories, etc., as well as decoding or encoding applications. These arrays
offer many advantages of integrated circuits such as high-density packaging
and improved reliability. This is a result of fewer pick and place operations,
smaller footprint, smaller weight, and elimination of various discrete
packages that may not be as user friendly in PC board mounting. They are
available with either Tin-Lead plating terminations or as RoHS Compliant
with annealed matte-Tin finish by adding an “e3” suffix to the part number.
*See MMAD1105(e3) for directing positive transients to positive side of the
power supply line.
IMPORTANT: For the most current data, consult MICROSEMI’s website: http://www.microsemi.com
Top Viewing Pin Layout
FEATURES
• 8 Diode Array
• Molded 14-Pin SOIC Package
• UL 94V-0 Flammability Classification
• Low Capacitance 1.5 pF per diode
• Switching speeds less than 5 ns
• RoHS Compliant devices available by adding “e3” suffix
• IEC 61000-4 compatible
61000-4-2 (ESD): Air 15kV, contact – 8 kV
61000-4-4 (EFT): 40A – 5/50 ns
61000-4-5 (surge): 12A, 8/20 µs
APPLICATIONS / BENEFITS
• Low capacitance steering diode protection for high
frequency data lines
• RS-232 & RS-422 Interface Networks
• Ethernet: 10 Base T
• Computer I / O Ports
• LAN
• Switching Core Drivers
MAXIMUM RATINGS
• Operating Temperature: -55°C to +150°C
• Storage Temperature: -55°C to +150°C
• Forward Surge Current: 2 Amps (8.3 ms)
12 Amps (8/20 µs)
• Continuous Forward Current: 400 mA (one diode)
• Power Dissipation (PD): 1500 mW (total)
• Solder Temperatures: 260°C for 10 s (maximum)
MECHANICAL AND PACKAGING
• CASE: Void-free transfer molded thermosetting
epoxy body meeting UL94V-0 flammability
classification
• TERMINALS: Tin-Lead or RoHS Compliant
annealed matte-Tin plating solderable per MIL-
STD-750 method 2026
• MARKING: MSC logo, MMAD1106 or
MMAD1106e3 and date code. Pin #1 is to the left
of the dot or indent on top of package
• WEIGHT: 0.127 grams (approximate)
• Tape & Reel packaging: 2500 pcs (STANDARD)
• Carrier tube packaging: 55 pcs
ELECTRICAL CHARACTERISTICS PER LINE @ 25°C Unless otherwise specified
PART
NUMBER
BREAKDOWN
VOLTAGE
VBR
@ IBR =100µA
V
WORKING
PEAK
REVERSE
VOLTAGE
VRWM
V
LEAKAGE
CURRENT
IR
TA = 25°C
µA
LEAKAGE
CURRENT
IR
TA = 150°C
µA
CAPACITANCE
C
@0V
pF
REVERSE
RECOVERY
TIME
trr
ns
FORWARD
VOLTAGE
VF
IF = 10 mA
V
FORWARD
VOLTAGE
VF
IF = 100 mA
V
MIN
MAX
MAX
@VR
MAX
@VR
TYP
MAX
MAX
MAX
MMAD1106
MMAD1106e3
90
75
0.200
20
300
20
1.5
5.0
1.00
1.20
Copyright © 2005
6-28-2005 REV K
Microsemi
Scottsdale Division
8700 E. Thomas Rd. PO Box 1390, Scottsdale, AZ 85252 USA, (480) 941-6300, Fax: (480) 947-1503
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