RB751V-40 データシートの表示（PDF） - Chip Integration Technology Corporation

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RB751V-40

30mA Surface Mount Small Signal Diodes

Chip Integration Technology Corporation 

RB751V-40

30mA Surface Mount Small Signal Diodes

■ Features

• Low current rectification and high speed switching.

• Extremely small surface mount type.

• Silicon epitaxial planar chip, metal silicon junction.

• Suffix "G" indicates Halogen-free part, ex.RB751VG-40.

• Lead-free parts meet environmental standards of

MIL-STD-19500 /228

■ Mechanical data

• Epoxy:UL94-V0 rated flame retardant

• Case : Molded plastic, SOD-323

• Terminals : Solder plated, solderable per

MIL-STD-750, Method 2026

• Polarity : Indicated by cathode band

• Weight : 0.0002 ounce, 0.005 gram

■ Outline

SOD-323

0.07 1 (1.80 )

0.06 3 (1.60 )

Marking code

0.03 9 (1.00 )Max.

0.10 6 (2.70 )

0.09 8 (2.50 )

Dimensions in inches and (millimeters)

■ Maximum ratings and electrical characteristics

Rating at 25OC ambient temperature unless otherwise specified. Single phase, half wave, 60Hz, resistive or inductive load.

For capacitive load, derate current by 20%.

Parameter

Symbol

RB751V-40

Marking code

JV, 5E

Maximum Recurrent Peak Reverse Voltage

VRM

Continuous reverse voltage

VR

Maximum Instantaneous Forward Voltage@1mA DC

VF

Power Dissipation

PD

Thermal resistance

junction to ambient

RθJA

Operating Temperature

TJ

Storage temperature

TSTG

40

40

0.37

150

520

-40 ~ +125

-40 ~ +125

UNIT

V

V

mW

OC/W

OC

OC

Parameter

Mean rectifying current

Forward surge current

Reverse current

Capacitance between terminals

Conditions

8.3ms single half sine-wave superimposed on

rate load (JEDEC method)

VR = 30V DC

VR = 10V DC, f = 1MHz

Symbol

IO

IFSM

IR

CT

MIN.

TYP.

20

MAX.

30

200

0.5

UNIT

mA

mA

uA

pF

Document ID : DS-22K2C

1

Issued Date : 2010/05/05

Revised Date : 2012/05/31

Revision : C

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