TGA8810 データシートの表示（PDF） - TriQuint Semiconductor
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TGA8810 Datasheet PDF : 7 Pages
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TGA8810-SCC
MECHANICAL DRAWING
1,6510
(0.0650)
0,1245
(0.0049)
0,9881
1
(0.0389)
0,7620
14
(0.0300)
0,6223
13
(0.0245)
1,3208
(0.0520)
1,3970
(0.0550)
2
3
1,7475
(0.0688)
4
1,5240
(0.0600)
1,4757
(0.0581)
1,3157
(0.0518)
5
1,0185
(0.0401)
0,1600
(0.0063)
0
12 11 10
9
8
7
6
0,1854
0 (0.0073)
0,4953
(0.0195)
0,8306
(0.0327)
1,1379
(0.0448)
0,1118 0,3378
(0.0044) (0.0133)
0,6604
(0.0260)
0,9855
(0.0388)
0,1499
(0.0059)
1,7501
(0.0689)
(0.0740)
Units: millimeters (inches)
Thickness: 0,1524 (0.006) (r eference only)
Chip-edge-to-bond-pad dimensions are shown to center of bond pad.
Chip size tolerance: ± 0,0508 (0.002)
Bond pad #1 (RF Input):
Bond pad #2 :
Bond pad #3 :
Bond pad #4 (VD2):
Bond pad #5 (RF Output):
Bond pad #6 (RS22):
Bond pad #7 (RS23):
Bond pad #8 (RS21):
Bond pad #9 (VD1):
Bond pad #10 (RS11):
Bond pad #11 (RS13):
Bond pad #12 (RS12):
Bond pad #13 (C2):
Bond pad #14 (C1):
0,1016 x 0,1778 (0.0040 x 0.0070)
0,1016 x 0,1016 (0.0040 x 0.0040)
0,1016 x 0,1016 (0.0040 x 0.0040)
0,1016 x 0,1016 (0.0040 x 0.0040)
0,0940 x 0,2540 (0.0037 x 0.0100)
0,1016 x 0,1016 (0.0040 x 0.0040)
0,1016 x 0,0787 (0.0040 x 0.0031)
0,1067 x 0,1016 (0.0042 x 0.0040)
0,1016 x 0,1041 (0.0040 x 0.0041)
0,1067 x 0,1016 (0.0042 x 0.0040)
0,1016 x 0,0787 (0.0040 x 0.0031)
0,1016 x 0,1016 (0.0040 x 0.0040)
0,0762 x 0,0762 (0.0030 x 0.0030)
0,0762 x 0,0762 (0.0030 x 0.0030)
7
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