TGA2507 データシートの表示（PDF） - TriQuint Semiconductor

部品番号

コンポーネント説明

メーカー

TGA2507

12-18 GHz Ku-Band 3-Stage Driver Amplifier

TriQuint Semiconductor 

Product Data Sheet

August 5, 2008

Chip Assembly Diagram

TGA2507

This configuration is for a self-bias logic pad current search with connections for bin

#1. See Table IV for alternate bin # to get the current of typical 80 ± 10% mA.

BIN No.

1

2

3

4

TABLE V

PAD CONNECTIONS

DC BIAS LADDER 1

Pad 6 to Pad 7

Pad 6 to Pad 8

Pad 6 to Pad 9

Pad 6 to Pad 10

DC BIAS LADDER 2

Pad 11 to Pad 12

Pad 11 to Pad 13

Pad 11 to Pad 14

Pad 11 to Pad 15

GaAs MMIC devices are susceptible to damage from Electrostatic Discharge. Proper precautions should

be observed during handling, assembly and test.

9

TriQuint Semiconductor Texas: Phone (972)994-8465 Fax (972)994-8504 Email: Info-mmw@tqs.com Web: www.triquint.com

Share Link: