TGA2533-SM データシートの表示（PDF） - TriQuint Semiconductor

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TGA2533-SM

Ku-Band Power Amplifier

TriQuint Semiconductor 

TGA2533-SM

Ku-Band Power Amplifier

Mechanical Information

Mounting Configuration

All dimensions are in millimeters (inches).

Notes:

1. A heatsink underneath the area of the PCB for the mounted device

is recommended for proper thermal operation.

2. Ground / thermal vias are critical for the proper performance of this device.

Vias have a final plated thru diameter of .40 mm (.016”).

.675

.675

Tape and Reel Information

Tape and reel specifications for this part are also available on the TriQuint website in the “Application Notes” section.

Standard T/R size = 500 pieces on a 7 x 0.5” reel.

CARRIER AND COVER TAPE DIMENSIONS

Part

Cavity

Distance Between Centerline

Cover Tape

Carrier Tape

Feature

Length

Width

Depth

Pitch

Cavity to Perforation

Length Direction

Cavity to Perforation

Width Direction

Width

Width

Symbol

A0

B0

K0

P1

P2

F

C

W

Size (in)

0.207

0.207

0.043

0.315

0.079

0.217

0.374

0.472

Size (mm)

5.25

5.25

1.10

8.00

2.00

5.50

9.5

12.0

Data Sheet: Rev D 11/05/13

© 2013 TriQuint Semiconductor, Inc.

- 11 of 13 -

Disclaimer: Subject to change without notice

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