CXA1994AM データシートの表示（PDF） - Sony Semiconductor

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CXA1994AM

M-ary FSK Demodulating Comparator

Sony Semiconductor 

Package Outline Unit : mm

CXA1994AM

8PIN SOP (PLASTIC)

+ 0.4

5.0 – 0.1

8

5

A

+ 0.4

1.25 – 0.15

0.10

CXA1994AM/BM

1

4

1.27

b

0.24 M

B

+ 0.15

0.1 – 0.1

+ 0.1

b = 0.4 – 0.05

(0.4)

b = 0.4 ± 0.03

0° to 10°

DETAILA

DETAIL B : SOLDER

DETAIL B : PALLADIUM

PACKAGE STRUCTURE

SONY CODE

EIAJ CODE

JEDEC CODE

SOP-8P-L03

SOP008-P-0225

PACKAGE MATERIAL

LEAD TREATMENT

LEAD MATERIAL

PACKAGE MASS

EPOXY RESIN

SOLDER/PALLADIUM

PLATING

42/COPPER ALLOY

0.1g

NOTE : PALLADIUM PLATING

This product uses S-PdPPF (Sony Spec.-Palladium Pre-Plated Lead Frame).

CXA1994BM

+ 0.4

6.1 – 0.1

8PIN SOP (PLASTIC) 300mil

8

5

+ 0.4

1.85 – 0.15

0.15

+ 0.2

0.1– 0.05

1

0.45 ± 0.1

4

1.27

+ 0.1

0.2 – 0.05

SONY CODE

EIAJ CODE

JEDEC CODE

± 0.12 M

SOP-8P-L01

∗SOP008-P-0300-A

PACKAGE STRUCTURE

PACKAGE MATERIAL

LEAD TREATMENT

EPOXY RESIN

SOLDER PLATING

LEAD MATERIAL

PACKAGE WEIGHT

COPPER / 42 ALLOY

0.1g

–8–

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