PACDN006(2010) データシートの表示（PDF） - ON Semiconductor

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PACDN006
(Rev.:2010)

6-Channel ESD Protection Array

ON Semiconductor 

PACDN006

Mechanical Details

The PACDN006 is supplied in a 8-pin MSOP package and the SOIC package.

MSOP-8 Mechanical Specifications, 8 pin

The 8-pin MSOP package dimensions are presented below.

PACKAGE DIMENSIONS

Package

Pins

MSOP

8

Dimensions

Millimeters

Min

Max

Inches

Min

Max

A

0.75

0.95

0.030 0.037

A1

0.05

0.15

0.002 0.006

B

0.28

0.38

0.011 0.015

C

0.13

0.23

0.005 0.009

D

2.90

3.10

0.114 0.122

E

2.90

3.10

0.114 0.122

e

0.65 BSC

0.026 BSC

H

4.90 BSC

0.193 BSC

L

0.40

0.70

0.016 0.028

# per tape

and reel

4000 pieces

Controlling dimension: millimeters

Dimensions for MSOP-8 Package

Rev. 4 | Page 8 of 9 | www.onsemi.com

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