HI-8110JPQI データシートの表示（PDF） - Holt Integrated Circuits
部品番号
コンポーネント説明
メーカー
HI-8110JPQI Datasheet PDF : 8 Pages
| |||
HI-8010/HI-8110 Series
ORDERING INFORMATION
PART
NUMBER
NUMBER OF MASTER PACKAGE
SEGMENTS /SLAVE DESCRIPTION
TEMPERATURE
BURN LEAD
RANGE
FLOW IN FINISH
TTL Logic Inputs
HI-8010J-85
32
HI-8010PQI
38
HI-8010PQT
38
BOTH 44 PIN PLASTIC J LEAD
-40°C TO +85°C
I
BOTH 52 PIN PLASTIC QUAD FLAT PACK (PQFP) -40°C TO +85°C
I
BOTH 52 PIN PLASTIC QUAD FLAT PACK (PQFP) -55°C TO +125°C T
NO SOLDER
NO SOLDER
NO SOLDER
HI-8010SM-32
38
HI-8010SM-36
30
BOTH 48 PIN CERAMIC LEADLESS CHIP CARRIER -55°C TO +125°C M
BOTH 40 PIN CERAMIC LEADLESS CHIP CARRIER -55°C TO +125°C M
YES SOLDER
YES SOLDER
CMOS Logic Inputs
HI-8110J-85
32
HI-8110PQI
38
HI-8110PQT
38
HI-8110SM-32
38
HI-8110SM-36
30
BOTH 44 PIN PLASTIC J LEAD
-40°C TO +85°C
I
BOTH 52 PIN PLASTIC QUAD FLAT PACK (PQFP) -40°C TO +85°C
I
BOTH 52 PIN PLASTIC QUAD FLAT PACK (PQFP) -55°C TO +125°C T
BOTH 48 PIN CERAMIC LEADLESS CHIP CARRIER -55°C TO +125°C M
BOTH 40 PIN CERAMIC LEADLESS CHIP CARRIER -55°C TO +125°C M
NO SOLDER
NO SOLDER
NO SOLDER
YES SOLDER
YES SOLDER
SEMI-CUSTOM PACKAGING
The above part numbers represent some of the typical configurations of the HI-8010 & HI-8110 products. They can also be provided
with a varied number of output segments (30, 32 and 38), with either industrial or military screening and in a wide variety of packages.
Listed below are currently available packages. Please contact the Holt Sales Department for your specific requirements.
PACKAGE
DESCRIPTION
PLASTIC DUAL-IN-LINE (PDIP)
PLASTIC QUAD FLAT PACK (PQFP)
PLASTIC J-LEAD CHIP CARRIER (PLCC)
CERAMIC DUAL-IN-LINE (CDIP)
CERAMIC LEADLESS CHIP CARRIER (LCC)
CERAMIC J-LEAD CHIP CARRIER
CERAMIC LEADED CHIP CARRIER
#
LEADS
40
48
52
44
40
48
40
48
44
48
40
48
HOLT INTEGRATED CIRCUITS
3-7
Share Link: 