HV582 データシートの表示（PDF） - Microchip Technology

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HV582

96-Channel Serial to Parallel Converter with Push-Pull Outputs

Microchip Technology 

HV582

DC ELECTRICAL CHARACTERISTICS (CONTINUED)

Electrical Specification: Unless otherwise specified, TA = TJ = +25°C, VDD = 5.0V and VPP = 80V.

Parameter

Symbol Min. Typ. Max. Units

Conditions

Logic Input Low Current

IIL

-1.0

–

–

µA VIL = -0.3V

Logic Output High

VOH

3.5

–

–

V IOUT = 4 mA

Logic Output Low

VOL

–

–

1.0

IOUT = -4 mA

Note 1: Specification is for design guidance only.

AC ELECTRICAL CHARACTERISTICS

Electrical Characteristics: Unless otherwise specified TA = TJ = +25°C, VDD = 5.0V and VPP = 80V.

Parameter

Symbol Min.

Typ.

Max. Units

Conditions

Data Clock Frequency

fCLK

—

—

Clock Pulse Width, High and Low

twCLK

16.6

—

LE Pulse Width, High and Low

twLE

16.6

—

Setup Time, DnA/B to CLK

tsu1

5

—

Setup Time, CLK to LE

tsu2

15

—

Setup Time, LE to OL,OH

Hold Time, CLK to DnA/B

Hold Time, LE to CLK

CLK to DnA/B (High-to-Low)

CLK to DnA/B (Low-to-High)

tsu3

25

—

th1

15

—

th2

15

—

tpdHL

—

—

tpdLH

—

—

LE,OL,OH to HVOUTn

(High-to-Low)

tpHL

—

—

30

MHz

—

ns Note 1

—

Note 2

—

Note 1

—

Note 1

—

Note 1

—

Note 1

—

Note 1

25

CL = 170 pF

25

CL = 170 pF

300

CL = 170 pF

LE,OL,OH to HVOUTn

(Low-to-High)

tpLH

—

—

300

OE to HVOUTn (High-to-Low)

tpHZL

—

—

150

OE to HVOUTn (Low-to-High)

tpLZH

—

—

150

OE to HVOUTn (High-to-Low)

tpHZ

—

—

300

OE to HVOUTn (Low-to-High)

tpLZ

—

—

300

Rise Time HVOUTn

tr

—

—

200

Fall Time HVOUTn

tf

—

—

200

Note 1: Specification is obtained by characterization and is not 100% tested.

2: Specification is for design guidance only.

CL = 170 pF

CL = 170 pF

CL = 170 pF

CL = 170 pF

CL = 170 pF

TEMPERATURE SPECIFICATIONS

Parameters

Sym.

Min.

Typ.

Max. Units

Conditions

Temperature Ranges

Operating Junction Temperature

Storage Temperature

Package Thermal Resistance

TJ

-40

—

+125

°C

TA

-65

—

+150

°C

Thermal Resistance, 169-Ball TFBGA

JA

—

27

—

°C/W

DS20005455A-page 4

 2015 Microchip Technology Inc.

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